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US 2022/0013380 A1Published application
High density pick and sequential place transfer process and tool
AssigneeApple Inc.
InventorsHyeun-Su Kim, Dariusz Golda, Chae Hyuck Ahn, Kevin T. Huang, Eric B. Newton
Life of this patent
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Abstract
Mass transfer tools and methods for high density transfer of arrays of micro devices are described. In an embodiment, a mass transfer tool includes a micro pick up array with an array of transfer heads arranged in clusters. The clusters of transfer heads can be used to pick up a high density group of micro devices followed by sequential placement onto a receiving substrate.
Claims31
A micro pick up array comprising:
- a base substrate;
- and
- an array of polycrystalline compliant transfer heads on the base substrate.
A micro pick up array comprising:
- a base substrate;
- an array of transfer heads over the base substrate, each transfer head including a mesa structure;
- an electrically conductive layer spanning over the mesa structure for each transfer head in the array of transfer heads;
- a first voltage source contact coupled with the electrically conductive layer;
- and
- a second voltage source contact coupled with the array of mesa structures of the array of transfer heads.
3 more elements
A micro pick up array comprising:
- a base substrate;
- a base spring layer over the base substrate, the base spring layer including a plurality of base spring arms and a spring platform;
- a mesa structure protruding from the spring platform;
- and
- an encapsulation membrane layer spanning over the base spring layer, wherein the mesa structure protrudes through a corresponding opening in the encapsulation membrane layer and is deflectable through the corresponding opening and toward the base substrate.
2 more elements
A micro pick up array comprising:
- a cluster of a plurality of transfer heads arranged in a plurality of rows of transfer heads;
- wherein each transfer head is an electrostatic transfer head that includes a first mesa structure and a second mesa structure;
- and
- a plurality of submesa interconnects, wherein each row of transfer heads spans over a pair of submesa interconnects, with each first mesa structure protrudes from a first submesa interconnect and each second mesa structure protrudes from a second submesa interconnect.
1 more element
Dependencies are inferred from the claim text.