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US 2022/0013376 A1Published application
Spot heating by moving a beam with horizontal rotary motion
AssigneeApplied Materials, Inc.
InventorsShu-Kwan Danny LAU, Toshiyuki NAKAGAWA, Zhiyuan YE
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Abstract
Embodiments of the present disclosure generally relate to apparatus and methods for semiconductor processing, more particularly, to a thermal process chamber. In one or more embodiments, a process chamber comprises a first window, a second window, a substrate support disposed between the first window and the second window, and a motorized rotatable radiant spot heating source disposed over the first window and configured to provide radiant energy through the first window.
Claims20
A process chamber, comprising:
- a first window;
- a second window;
- a substrate support disposed between the first window and the second window;
- and
- a motorized rotatable radiant spot heating source disposed over the first window and configured to provide radiant energy through the first window.
2 more elements
A spot heating source assembly, comprising:
- a collimator holder;
- and
- a rotary stage disposed at a first plane, wherein the collimator holder is mounted to the rotary stage at an acute angle with respect to the first plane.
A method for spot heating, comprising:
- disposing a substrate on a substrate support in a process chamber;
- activating a spot heating source mounted on a rotary stage to project radiant energy to the substrate;
- moving the spot heating source along an arcuate path to adjust an impact point of the projected radiant energy on the substrate;
- and
- heating a desired area of the substrate with the projected radiant energy.
2 more elements
Dependencies are inferred from the claim text.