Electronic component

An electronic component comprising:

• a multilayer body including a multilayer main body and side gap portions, the multilayer main body including an inner layer portion including dielectric layers and internal nickel electrode layers laminated alternately therein, and including end surfaces provided on both sides in a length direction intersecting a lamination direction, wherein the internal nickel electrode layers are exposed at the end surfaces, the side gap portions being provided on both sides of the multilayer main body in a width direction intersecting the lamination direction and the length direction;
• external nickel layers on the end surfaces of the multilayer body;
• and
• external copper electrode layers covering the end surfaces on which the external nickel layers are provided;
• wherein
• a deviation amount in the width direction between positions of ends of two internal nickel electrode layers adjacent in the lamination direction on both side surfaces is about 0.5 μm or less;
• the multilayer body includes a rounded ridge portion;
• the external nickel layers are each provided on the end surface of the multilayer body, in a region other than a region including the rounded ridge portion;
• and
• a nickel layer and a tin layer are provided outside the external copper electrode layer.