Electronic component and method of manufacturing the electronic component

An electronic component comprising:

• a multilayer body including a multilayer main body and side gap portions, wherein the multilayer main body includes an inner layer portion including dielectric layers and internal nickel electrode layers laminated alternately therein, and including end surfaces provided on both sides in a length direction intersecting a lamination direction, the internal nickel electrode layers being exposed at the end surfaces, and the side gap portions being provided on both sides of the multilayer main body in a width direction intersecting the lamination direction and the length direction;
• external nickel layers on the end surfaces of the multilayer main body;
• and
• external copper electrode layers covering the end surfaces on which the external nickel layers are provided;
• wherein
• at least one of a nickel-based oxide or a silicon-based oxide is provided between the external nickel layer and the external copper electrode layer;
• a nickel layer and a tin layer are provided outside the external copper electrode layer;
• and
• in a cross section passing through a middle of the electronic component in the width direction and extending in the length direction and the lamination direction, when the external nickel layer is divided into four equal portions in the lamination direction by three linear lines extending in the length direction, an average value of a thickness of the external nickel layer on a center linear line among the three linear lines is defined as Tem, and an average value of a thickness of the external nickel layer on all of the three linear lines is defined as Tea, and a relationship of about 0.2≤Tea/Tem≤about 1.1 is satisfied.