Electronic component

An electronic component comprising:

• a multilayer body including a multilayer main body and side gap portions, the multilayer main body including an inner layer portion including dielectric layers and internal nickel electrode layers laminated alternately therein, and including end surfaces on both sides in a length direction intersecting a lamination direction, wherein the internal nickel electrode layers are exposed at the end surfaces, the side gap portions being provided on both sides of the multilayer main body in a width direction intersecting the lamination direction and the length direction;
• external nickel layers on the end surfaces of the multilayer body;
• and
• external copper electrode layers covering the end surfaces on which the external nickel layers are provided;
• wherein where a dimension of each of the external nickel layers in the lamination direction is defined as TN and a dimension of the inner layer portion in the lamination direction is defined as T1, a relationship of T1<TN is satisfied;
• where a dimension of each of the external nickel layers in the width direction is defined as WN and a dimension of the inner layer portion in the width direction is defined as W1, a relationship of WN<W1 is satisfied;
• a relationship of WN<TN is satisfied in the external nickel layer;
• and
• the inner layer portion includes at least one uncovered region which is not covered with the external nickel layer in the width direction, the internal nickel electrode layers are directly bonded to the external copper electrode layers in the uncovered region, and a diffusion region is provided in which copper of the external copper electrode layers is diffused in the internal nickel electrode layers.