Electronic substrates having embedded dielectric magnetic material to form inductors
AssigneeIntel Corporation
InventorsAndrew J. Brown, Prithwish Chatterjee, Lauren A. Link, Sai Vadlamani
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Abstract
An inductor may be fabricated comprising a magnetic material layer and an electrically conductive via or trace extending through the magnetic material layer, wherein the magnetic material layer comprises dielectric magnetic filler particles within a carrier material. Further embodiments may include incorporating the inductor of the present description into an electronic substrate and may further include an integrated circuit device attached to the electronic substrate and the electronic substrate may further be attached to a board, such as a motherboard.
Claims25
An apparatus comprising a magnetic material layer and an electrically conductive via extending through the magnetic material layer, wherein the magnetic material layer comprises dielectric magnetic filler particles within a carrier material and wherein the magnetic material layer contacts the electrically conductive via.
An electronic system, comprising:
- a board;
- and
- an electronic package attached to the board, wherein the electronic package comprises:
- an electronic substrate having at least one dielectric layer;
- an inductor embedded in the electronic substrate, wherein the inductor comprises a magnetic material layer and an electrically conductive via extending through the magnetic material layer, wherein the magnetic material layer comprises dielectric magnetic filler particles within a carrier material and wherein the magnetic material layer contacts the electrically conductive via.
A method of fabricating an electronic structure, comprising:
- forming at least one dielectric layer;
- forming at least one via through the at least one dielectric layer;
- forming a magnetic material layer within the at least one via, wherein the magnetic material layer comprises dielectric magnetic filler particles within a carrier material;
- and
- forming an electrically conductive via extending through the magnetic material layer, wherein the magnetic material layer contacts the electrically conductive via.
Dependencies are inferred from the claim text.