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US 2022/0012261 A2Published application
Wafer-level package assembly handling
AssigneeRudolph Technologies, Inc.
InventorsKevin Barr, Edward Condon
Life of this patent
Estimating the term…
Abstract
A chuck assembly includes an upper surface configured to support a wafer-level package assembly and a clamping mechanism securing the wafer-level package assembly to the upper surface.
Claims20
A wafer-level package handling system, comprising:
- a chuck assembly defining an upper surface configured to support a wafer-level package assembly;
- a clamping mechanism securing the wafer-level package assembly to the upper surface.
A method of handling a package assembly of a semiconductor device, comprising:
- loading the package assembly on a surface of a chuck assembly;
- positioning a cover over the package assembly;
- applying pressure to the cover to secure the package assembly to the surface;
- and
- inspecting the package assembly.
2 more elements
Dependencies are inferred from the claim text.