Imaging optical system, exposure apparatus, and article manufacturing method

An exposure apparatus that exposes a substrate while scanning a mask and the substrate, comprising:

• a projection optical system configured to cause, by using an off-axis annular good image area, a light flux emitted from a pattern of the mask to be reflected by a first plane surface, a first concave surface, a convex surface, a second concave surface, and a second plane surface in this order, and then imaged on the substrate;
• and
• a plurality of adjusters configured to adjust a shape of each of the first concave surface and the second concave surface by applying a force to a rear surface of each of the first concave surface and the second concave surface,
• wherein if points obtained by projecting force acting points of the plurality of adjusters on the first concave surface and the second concave surface in a direction parallel to an optical axis of the convex surface are defined as correction points,
• the acting points are set such that, when a first ray and a second ray in a light flux emitted from one point on the mask are reflected by the first concave surface and the second concave surface, the first ray strikes the correction point of the first concave surface but does not strike the correction point of the second concave surface, and the second ray does not strike the correction point of the first concave surface but strikes the correction point of the second concave surface.

An exposure apparatus that exposes a substrate while scanning a mask and the substrate, comprising:

• a projection optical system configured to cause, by using an off-axis annular good image area, a light flux emitted from a pattern of the mask to be reflected by a first plane surface, a first concave surface, a convex surface, a second concave surface, and a second plane surface in this order, and then imaged on the substrate;
• and
• a plurality of adjusters configured to adjust a shape of each of the first plane surface and the second plane surface by apply a force to a rear surface of each of the first plane surface and the second plane surface,
• wherein if points obtained by projecting force acting points of the plurality of adjusters on the first plane surface in a direction orthogonal to the first plane surface and points obtained by projecting force acting points of the plurality of adjusters on the second plane surface in a direction orthogonal to the second plane surface are defined as correction points,
• the acting points are set such that, when a first ray and a second ray in a light flux emitted from one point on the mask are reflected by the first plane surface and the second plane surface, the first ray strikes the correction point of the first plane surface but does not strike the correction point of the second plane surface, and the second ray does not strike the correction point of the first plane surface but strikes the correction point of the second plane surface.

An exposure apparatus that exposes a substrate while scanning a mask and the substrate, comprising:

• a projection optical system configured to cause, by using an off-axis annular good image area, a light flux emitted from a pattern of the mask to be reflected by a first plane surface, a first concave surface, a convex surface, a second concave surface, and a second plane surface in this order, and then imaged on the substrate;
• and
• a plurality of adjusters configured to adjust a shape of each of the first plane surface and the convex surface by apply a force to a rear surface of each of the first plane surface and the convex surface,
• wherein if points obtained by projecting force acting points of the plurality of adjusters on the first plane surface in a direction orthogonal to the first plane surface and points obtained by projecting force acting points of the plurality of adjusters on the convex surface in a direction parallel to an optical axis of the convex surface are defined as correction points,
• the acting points are set such that, when a first ray and a second ray in a light flux emitted from one point on the mask are reflected by the first plane surface and the convex surface, the first ray strikes the correction point of the first plane surface but does not strike the correction point of the convex surface, and the second ray does not strike the correction point of the first plane surface but strikes the correction point of the convex surface.

An exposure apparatus that exposes a substrate while scanning a mask and the substrate, comprising

• a projection optical system configured to project a pattern of the mask onto the substrate,
• wherein the projection optical system includes a first concave surface, a convex surface, and a second concave surface, and is configured to cause light transmitted through the pattern of the mask to be reflected by the first concave surface, the convex surface, and the second concave surface in this order,
• the projection optical system further includes a plurality of adjusters configured to apply a force to a rear surface of each of the first concave surface and the second concave surface to adjust a shape of each of the first concave surface and the second concave surface, and
• the plurality of adjusters are arranged such that force acting points of the plurality of adjusters on the first concave surface and the second concave surface are non-axisymmetric with respect to a horizontal line orthogonal to an optical axis of the convex surface.

An exposure apparatus that exposes a substrate while scanning a mask and the substrate, comprising

• a projection optical system configured to project a pattern of the mask onto the substrate,
• wherein the projection optical system includes a first plane surface, a first concave surface, a convex surface, a second concave surface, and a second plane surface, and is configured to cause light transmitted through the pattern of the mask to be reflected by the first plane surface, the first concave surface, the convex surface, the second concave surface, and the second plane surface in this order,
• the projection optical system further includes a plurality of adjusters configured to apply a force to a rear surface of each of the first plane surface and the second plane surface to adjust a shape of each of the first plane surface and the second plane surface, and
• the plurality of adjusters are arranged such that force acting points of the plurality of adjusters on the first plane surface and the second plane surface are non-axisymmetric with respect to a horizontal line orthogonal to an optical axis of the convex surface.

An exposure apparatus that exposes a substrate while scanning a mask and the substrate, comprising

• a projection optical system configured to project a pattern of the mask onto the substrate,
• wherein the projection optical system includes a first plane surface, a first concave surface, a convex surface, a second concave surface, and a second plane surface, and is configured to cause light transmitted through the pattern of the mask to be reflected by the first plane surface, the first concave surface, the convex surface, the second concave surface, and the second plane surface in this order,
• the projection optical system further includes a plurality of adjusters configured to apply a force to a rear surface of each of the first plane surface and the convex surface to adjust a shape of each of the first plane surface and the convex surface, and
• the plurality of adjusters are arranged such that, when a first effective light flux area which is an effective light flux area of the first plane surface, positions of force acting points of the plurality of adjusters projected in the first effective light flux area, a second effective light flux area which is an effective light flux area of the convex surface, and positions of force acting points of the plurality of adjusters projected in the second effective light flux area are superimposed, the positions of the force acting points of the plurality of adjusters projected in the first effective light flux area are different from the positions of the force acting points of the plurality of adjusters projected in the second effective light flux area.