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US 2022/0011529 A1Published application
Method and system for attaching optical fibers to warped photonic chips
AssigneeIntel Corporation
InventorsSufi AHMED, Vineeth ABRAHAM, Eric MORET, Paul DIGLIO
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Abstract
The present disclosure relates to a method including arranging multiple optical fibers between a die and a lid, wherein the die is bent and comprises multiple grooves, each optical fiber in or close to a separate groove; bonding the lid to the die to hold the multiple optical fibers in place in the multiple grooves, wherein the bonding comprises applying a bonding force non-uniformly across the lid to conform the lid to the bent die. A corresponding system is also disclosed herein.
Claims20
A method comprising:
- arranging multiple optical fibers between a die and a lid, wherein the die is bent and comprises multiple grooves, each optical fiber in or close to a separate groove;
- bonding the lid to the die to hold the multiple optical fibers in place in the multiple grooves, wherein the bonding comprises applying a bonding force non-uniformly across the bent die.
A system comprising:
- a die, wherein the die is bent and comprises multiple grooves;
- multiple optical fibers, each optical fiber in or close to a separate groove;
- a lid over the die and the multiple optical fibers;
- and
- a bonding apparatus comprising a bond head section configured to make multiple contact points with the lid to conform the lid to the bent die.
2 more elements
Dependencies are inferred from the claim text.