Optical module and method of producing the same

A method of producing an optical module including a base plate;

• a carrier;
• an optical semiconductor device having an optical end surface and being configured to emit an outgoing beam from the optical end surface or receive an incoming beam at the optical end surface;
• and an optical lens component having a first lens surface and a second lens surface, the first lens surface being provided between the optical semiconductor device and the second lens surface,
• the method comprising:
• positioning the optical semiconductor device and the optical lens component so that an optical end surface of the optical semiconductor device disposed on the base plate with the carrier interposed between the optical semiconductor device and the base plate faces the first lens surface of the optical lens component;
• aligning the optical lens component so that the outgoing beam of the optical semiconductor device becomes collimated light, or an optical coupling efficiency of the outgoing beam reaches a maximum value or a predetermined value, or an optical coupling efficiency of the incoming beam reaches a maximum value or a predetermined value;
• offsetting the optical lens component from a position where the aligning is performed to separate the optical lens component from the optical semiconductor device along either an optical axis of the outgoing beam or an optical axis of the incoming beam;
• filling a gel-like transmissive resin between the optical lens component on which the offsetting has been performed and the optical semiconductor device, the gel-like transmissive resin allowing at least one of light curing and thermal curing;
• and
• curing the gel-like transmissive resin filled between the optical lens component and the optical semiconductor device by performing at least one of the light curing and the thermal curing on the transmissive resin,
• wherein in the filling, the gel-like transmissive resin is filled so that when the gel-like transmissive resin is cured, the transmissive resin contains either an optical path of the outgoing beam or an optical path of the incoming beam between the optical end surface of the optical semiconductor device and the first lens surface of the optical lens component.