Testing probe system for testing semiconductor die, multi-channel die having shared pads, and related systems and methods

A multi-channel die, comprising:

• a semiconductor material;
• first native probe pads on an upper surface of the semiconductor material and operably coupled to a first channel of the multi-channel die;
• second native probe pads on the upper surface of the semiconductor material and operably coupled to a second channel of the multi-channel die;
• and
• shared probe pads on the upper surface of the semiconductor material between the first native probes pads and the second native probe pads and operably coupled to both the first channel and the second channel of the multi-channel die.

A method of testing at least one multi-channel die, the method comprising:

• selecting a first channel of a multi-channel die to test;
• selecting at least one test mode for testing the first channel of the multi-channel die;
• and
• contacting a probe of a testing probe system with a shared probe pad of the multi-channel die to initiate a single continuous contact period, and during the single continuous contact period:
• stimulating at least the first channel of the multi-channel die via the shared probe pad;
• acquiring a first output of the first channel of the multi-channel die via the shared probe pad;
• selecting a second channel of the multi-channel die to test;
• selecting at least one test mode for testing the second channel of the multi-channel die;
• stimulating at least the second channel of the multi-channel die via the shared probe pad;
• and
• acquiring a second output of the second channel of the multi-channel die via the shared probe pad.

A testing probe system, comprising:

• probes configured for contacting shared probe pads of multi-channel die of a wafer;
• and
• a controller configured for generating testing patterns and receiving signals from the multi-channel die of the wafer, the controller comprising:
• a processor;
• and
• a non-transitory computer-readable storage medium storing instructions thereon that, when executed by the processor, effectuate contact of a probe of the probes with a shared probe pad of the multi-channel die to:
• initiate a single contact period;
• and
• during the single contact period, test functionalities of at least two channels of the multi-channel die via the same probe and same shared probe pad.