Heat-dissipation device of led
OwnerYixing ZHANGinventor
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Abstract
A heat-dissipation device for LEDs includes a plurality of heat conducting material wires. The heat-dissipation housing of an LED chip is in contact with one end of the heat conducting material wires through a heat conducting material or in a direct manner so that heat is transferred from the housing to the wires and further to the surrounding air. The heat conducting material wires are arranged in an air flowing pipeline and the heat is taken away by the flowing air. The pipeline is made of insulation materials.
Claims11
A heat-dissipation device of an LED, wherein the device comprises a large number of heat conducting material wires made of a heat conducting material, the diameters of the heat conducting material wires are greater than 0.01 mm and less than 0.3 mm, and the ratios of length to diameter of the heat conducting material wires are greater than 20, a heat-dissipation housing of an LED chip is contacted with one end of the heat conducting material wires made of the heat conducting material through the heat conducting material or in a direct manner, in order to heat air around the heat conducting material wires, and the heat is taken away by the flowing air,
- wherein, one end of the heat conducting material wires is integrated with the heat-dissipation housing of the LED chip by welding, casting or thermally conductive adhesive bonding.
Dependencies are inferred from the claim text.