Substrate support, apparatus for processing substrate, and method of adjusting temperature of substrate

An apparatus for processing a substrate, comprising:

• a substrate support comprising:
• a main body of the substrate support that a substrate is placed on and that receives a heat input from at least an outside of the substrate support,
• a refrigerant passage provided in the main body and configured to take heat from the main body by a refrigerant,
• a switching mechanism that switches a position where the refrigerant is supplied to the refrigerant passage and a position where the refrigerant is discharged from the refrigerant passage between one end and the other end of the refrigerant passage in order to reverse a direction in which the refrigerant flows in the refrigerant passage, and
• a control unit configured to control the switching mechanism to repeatedly reverse the direction in which the refrigerant flows during a period in which the main body receives the heat input,
• wherein the main body is provided with a heater configured to heat the main body, and the period of receiving the heat input includes a period in which the main body is heated by the heater;
• and
• a processing chamber in which the substrate support is provided and which forms a processing space in which processing of a substrate is performed.

A method of adjusting a temperature of a substrate, the method comprising:

• placing the substrate on a main body of a substrate support that receives a heat input from at least an outside of the substrate support;
• and
• passing a refrigerant through a refrigerant passage provided in the main body and taking heat from the main body,
• wherein the taking of heat from the main body is performed by repeatedly reversing a direction in which the refrigerant flows in the refrigerant passage during a period in which the main body receives heat input.