Polyimide precursor composition and polyimide film manufactured using same
AssigneeLG Chem, Ltd.
InventorsJinyoung PARK, Chan Hyo PARK, Danbi CHOI
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Abstract
The present invention relates to a polyimide precursor composition, and a polyimide film manufactured using same. According to the present invention, since a polyimide film is manufactured from a mixture of a polyimide precursor having a structure that is advantageous to surface charge accumulation and a polyimide precursor having a structure capable of exhibiting high heat-resistant characteristics, a flexible device using the polyimide film as a substrate can have both improved charge accumulation characteristics caused by an electric field to be generated during the operation of a TFT device and heat high heat-resistant characteristics.
Claims19
A polyimide precursor composition comprising:
- a first polyamic acid having a repeating structure of the following formula 1 and having a reactive end capper having a reactive functional group;
- and
- a second polyamic acid having a repeating structure of the following formula 2:
Dependencies are inferred from the claim text.