Antislip flexible materials and methods for their making and use

A method for forming an antislip flexible material, comprising:

• providing a flexible carrier having a front surface, the provided carrier at least partly including a thermoplastic first polymer, the carrier having at the providing a temperature sufficiently low to keep the first polymer from melting or softening;
• providing a hot release surface of a first temperature;
• providing a first layer of discrete particles including a thermoplastic second polymer, sitting on the hot release surface and projecting from the hot release surface to corresponding terminal ends, in the provided first layer the discrete particles being at least partly of or above a second temperature, the second temperature being above a softening temperature of the second polymer, providing in the first layer a tackiness of at least the particle terminal ends;
• bringing into an, at least partial, contact, and keeping in the contact for a contacting time, the front surface of the provided carrier with the tacky first layer sitting on the hot release surface for at least partly sticking the first layer to the front surface, and thereafter
• removing the carrier, and therewith at least partly the tacky first layer stuck to its front surface, from the release surface thereby providing the carrier with a coating of a hot state, and utilising a heat energy of the hot coating forming a bond between the carrier and the coating, thereby providing an antislip coated flexible material including the carrier and the coating bonded thereto;
• the removing of the carrier including pulling the carrier out of the contact with a pulling-out force,
• wherein:
• providing the first temperature above the softening temperature of the second polymer;
• and
• providing the first temperature above any one or both of a melting temperature and a softening temperature of the first polymer;
• selecting a carrier that is spoiled through one or more of breaking, stretching, shrinking, and warping if heated completely to the first temperature and simultaneously exposed to the pulling-out force;
• and
• selecting the contacting time shorter than a minimum time, which minimum time is determined such that the spoiling of the carrier by exertion of heat by the hot release surface is limited to a predefined allowable extent.