Cyclic phosphazene compound, flame retardant for resin, resin composition including same, and molding of said resin composition

2:

• The resin composition comprising a resin and the cyclic phosphazene compound of claim 1.

3:

• The resin composition according to claim 2, wherein the cyclic phosphazene compound is present in an amount of 0.01 to 50 parts by mass, per 100 parts by mass of the resin.

4:

• The resin composition according to claim 2, wherein the resin is at least one member selected from the group consisting of epoxy resin, thermosetting acrylic resin, diallyl phthalate resin, unsaturated polyester resin, styrene-based resin, polyester resin, polycarbonate resin, polyphenylene ether-based resin, and polyamide resin.

5:

• A molded article prepared by using the resin composition of claim 2.

6:

• An electric or electronic component prepared by using the resin composition of claim 2.

7:

• A sealing material for a semiconductor device, the sealing material comprising the resin composition of claim 2.

8:

• A substrate material prepared by using the resin composition of claim 2.

9:

• A method for producing a cyclic phosphazene compound represented by formula (1):
• the method comprising reacting decachlorocyclopentaphosphazene with 2,2′-biphenolate.

10:

• A flame retardant for resin, the flame retardant comprising a cyclic phosphazene compound represented by formula (1)

11:

• The resin composition according to claim 3, wherein the resin is at least one member selected from the group consisting of epoxy resin, thermosetting acrylic resin, diallyl phthalate resin, unsaturated polyester resin, styrene-based resin, polyester resin, polycarbonate resin, polyphenylene ether-based resin, and polyamide resin.

12:

• A molded article prepared by using the resin composition of claim 3.

13:

• A molded article prepared by using the resin composition of claim 4.

14:

• An electric or electronic component prepared by using the resin composition of claim 3.

15:

• An electric or electronic component prepared by using the resin composition of claim 4.

16:

• A sealing material for a semiconductor device, the sealing material comprising the resin composition of claim 3.

17:

• A sealing material for a semiconductor device, the sealing material comprising the resin composition of claim 4.

18:

• A substrate material prepared by using the resin composition of claim 3.

19:

• A substrate material prepared by using the resin composition of claim 4.