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US 2021/0394229 A1Published application
Metal surface protection
AssigneeInternational Business Machines Corporation
InventorsAli Afzali-Ardakani, David L. Rath, Sarunya Bangsaruntip, George Gabriel Totir
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Abstract
Techniques regarding methods and/or apparatuses for protecting metal substrates during one or more lithography processes are provided. For example, one or more embodiments described herein can comprise a method that can include coating a metal substrate with a polymer film that self-assembles on a metal oxide positioned on a surface of the metal substrate. The method can also include covalently bonding the polymer film to the metal oxide.
Claims20
A method, comprising:
- coating a metal substrate with a polymer film that self-assembles on a metal oxide positioned on a surface of the metal substrate;
- and
- covalently bonding the polymer film to the metal oxide.
A method, comprising:
- coating a metal substrate with an organic polymer film that includes a functional group that forms a self-assembled layer on a metal oxide surface of the metal substrate;
- and
- bonding the organic polymer film to the metal oxide surface.
An apparatus, comprising:
- a metal oxide surface located on a metal substrate;
- and
- an organic polymer film positioned on the metal oxide, wherein the organic polymer film self-assembles and bonds to the metal oxide surface.
Dependencies are inferred from the claim text.