Resin composition for generating allylphenol-maleimide copolymer for electronic component protective film, and electronic component protective film comprising this copolymer
AssigneesOsaka Research Institute of Industrial Science and Technology, Koa Corporation
InventorsKeiko OHTSUKA, Morio YONEKAWA, Hajime KIMURA, Ken YOSHIOKA, Nobuhiro KANAMARU, Masaki SUWA, Kazumi MACHIDA
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Abstract
This invention provides a resin composition for preparing an allylphenol-maleimide copolymer used for a protective film for an electronic component including: (A) an allyl group-containing phenol compound having a rigid structure; (B) an N-aromatic maleimide group-containing compound having a rigid structure; and (C) an N-aliphatic maleimide group-containing compound having a flexible structure.
Claims9
A resin composition for preparing an allylphenol-maleimide copolymer used for a protective film for an electronic component comprising:
- (A) an allyl group-containing phenol compound having a rigid structure;
- (B) an N-aromatic maleimide group-containing compound having a rigid structure;
- and
- (C) an N-aliphatic maleimide group-containing compound having a flexible structure.
Dependencies are inferred from the claim text.