US 2021/0387182 A1 · REVERSIBLE MICROFLUIDIC CHIP

Abstract

The invention relates to a reversible microfluidic chip comprising at least one lower part and at least one upper part configured to come into contact with said lower part and to close said chip, said lower part and/or said upper part comprising a microfluidic structure, and said upper part comprising at least one layer of a flexible epoxide polymer material and at least one layer of a rigid epoxide polymer material, at least one part of the flexible layer being directly in physical contact with the lower part of the chip when said chip is in the closed configuration, to the method for the fabrication thereof, to the use of said upper part in a reversible microfluidic chip, to said upper part for producing said chip, and to the uses of said chip in various applications.

Claims18

Dependent claims

A reversible microfluidic chip comprising:

at least one lower part and at least one upper part configured to come into contact with said lower part and to close said chip, characterized in that:
said lower part and/or said upper part comprises a microfluidic structure,
said upper part comprises at least a first layer of an epoxide polymer material having a Young's modulus Y1, and at least a second layer of an epoxide polymer material having a Young's modulus Y2, said first and second layers being such that:
the Y1/Y2 ratio is greater than or equal to 50,
Y2 is less than or equal to 50 MPa, and
at least one part of said second layer is directly in physical contact with the lower part of said chip when the chip is in the closed configuration.

3 more elements

Dependencies are inferred from the claim text.

Reversible microfluidic chip

Life of this patent

Reversible microfluidic chip

Life of this patent

Abstract

Claims18