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US 2021/0381775 A1Published application
Heat dissipation plate and method for manufacturing the same
AssigneeCooler Master Co., Ltd.
InventorsWei-Lung Chan, Wen-Ti Cheng
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Abstract
A method for manufacturing a heat dissipation device that includes stamping a composite plate including a welding material to form a first plate having a plurality of angled grooves, depositing powder in the plurality of angled grooves of the first plate, contacting the first plate to a second plate, and welding the first plate and the second plate together, and sintering powder to obtain a capillary structure.
Claims3
A method for manufacturing a heat dissipation device, comprising:
- stamping a non-composite plate not including a welding material to form a first plate having a plurality of angled grooves;
- depositing powder in the plurality of angled grooves of the first plate;
- sintering the powder to obtain a capillary structure;
- contacting the first plate to a second plate;
- and
- welding the first plate and the second plate together.
3 more elements
Dependencies are inferred from the claim text.