Thermal assemblies for nucleic acid preparation
AssigneeArcherDX, Inc.
InventorsJoshua Stahl, Jason Myers
Life of this patent
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Abstract
Provided herein are apparatus for independently manipulating the temperature of a plurality of reaction vessels, e.g., for automated processing of nucleic acids present in the vessels. Printed circuit boards (PCBs) comprising a mount area arranged to have mounted thereon a through-hole thermoelectric device (TED) to facilitate independent temperature control of reaction vessels are also provided, as well as methods relating to the same.
Claims61
An apparatus for independently manipulating the temperature of a plurality of reaction vessels, the apparatus comprising:
- a base assembly comprising i) a plurality of receptacles, each receptacle being configured to have disposed therein a reaction vessel, and ii) a plurality of thermoelectric devices, wherein each receptacle comprises a thermal jacket in thermal communication with at least one of the plurality of thermoelectric devices, wherein the thermal jacket has a first thermal transfer surface configured to surround at least a portion of a reaction vessel to facilitate thermal exchange between the reaction vessel and the jacket.
An apparatus for managing temperature of a plurality of reaction vessels, the apparatus comprising:
- a base assembly comprising a plurality of receptacles, wherein each receptacle is configured to have disposed therein a reaction vessel, and wherein each receptacle comprises a thermal jacket in thermal communication with a thermoelectric device, wherein the thermal jacket has a first thermal transfer surface configured to surround at least a portion of a reaction vessel to facilitate thermal exchange between the reaction vessel and the jacket;
- and
- a thermal cover assembly configured to provide a heat source above each reaction vessel to prevent or minimize evaporation of a reaction solvent present in the reaction vessel, wherein the thermal cover assembly has at least two independently thermally controlled zones.
A method of manufacturing a circuit having a through-hole thermoelectric device (TED) mounted to a printed circuit board (PCB), wherein the through-hole TEC is packaged with a through-hole mount packaging and wherein the through-hole TED comprises a first side having a first surface area, the method comprising:
- mounting the through-hole TED to the PCB in a mount area of the PCB arranged for mounting of the through-hole TED to the PCB, wherein the mount area comprises first holes corresponding to through-hole leads of the through-hole TED and a second hole having a size matching the first surface area of the first side of the through-hole TED, and wherein mounting the through-hole TED to the PCB comprises:
- attaching the through-hole leads of the through-hole TED to the PCB via the first holes, and
- arranging the through-hole TED on the PCB such that the first side of the through-hole TED is aligned with the second hole of the mounting area.
An apparatus comprising:
- a printed circuit board (PCB) comprising a mount area arranged to have mounted thereon a through-hole thermoelectric device (TED), the through-hole TED being packaged with a through-hole mount packaging, wherein the mount area comprises:
- first holes corresponding to through-hole leads of the through-hole TED;
- and
- a second hole having a size matching a first surface area of a first side of the through-hole TED.
An apparatus comprising:
- a printed circuit board (PCB);
- and
- a through-hole TED,
- wherein the PCB comprises a mount area arranged to have mounted thereon a through-hole thermoelectric device (TED), the through-hole TED being packaged with a through-hole mount packaging, wherein the mount area comprises:
- first holes corresponding to through-hole leads of the through-hole TED;
- and
- a second hole having a size matching a first surface area of a first side of the through-hole TED;
- and
- wherein the through-hole TED is mounted in the mount area of the PCB, the through-hole TED being mounted to the PCB with through-hole pins of the through-hole TED attached to the first holes of the PCB and the first side of the through-hole TED aligned with the second hole of the PCB.
A method of manufacturing a printed circuit board (PCB), the method comprising:
- forming the PCB with a mount area arranged to have mounted thereon a through-hole thermoelectric device (TED), the through-hole TED being packaged with a through-hole mount packaging, wherein forming the PCB with the mount area comprises:
- forming the PCB with first holes corresponding to through-hole leads of the through-hole TED;
- and
- forming the PCB with a second hole having a size matching a first surface area of a first side of the through-hole TED.
Dependencies are inferred from the claim text.