Liquid submersion cooled electronic systems

A method of cooling a heat generating electronic computer component of a computing system, comprising:

• submerging the heat generating electronic computer component, that is mounted on an upper surface of a circuit board, of the computing system in a dielectric cooling liquid contained in an interior space defined within an enclosure of the computing system so that the heat generating electronic computer component is in direct contact with the dielectric cooling liquid;
• the liquid-tight enclosure includes a first wall and a second wall opposite the first wall that are parallel to the circuit board, a first side wall, a second side wall, a first end wall and a second end wall;
• after contacting the heat generating electronic computer component, circulating the dielectric cooling liquid through a heat exchanger to cool the dielectric cooling liquid without circulating the dielectric cooling liquid to an external heat exchanger, wherein the dielectric cooling liquid is circulated by a pump disposed within the interior space of the liquid-tight enclosure and submerged in the dielectric cooling liquid and the pump is not mounted on the circuit board;
• and
• directing a return flow of the dielectric cooling liquid, after being cooled in the heat exchanger, into a manifold that does not overlap the upper surface and that is not affixed to the circuit board, and thereafter from the manifold directly onto the submerged heat generating electronic computer component or directly onto a heat sink that is fixed to the submerged heat generating electronic computer component.

A liquid submersion cooled computer, comprising:

• a sealed, liquid-tight enclosure defining an interior space;
• a circuit board disposed in the interior space, an upper surface of the circuit board being parallel to a bottom wall and a top wall of the sealed, liquid-tight enclosure;
• a heat generating electronic computer component disposed on the upper surface of the circuit board;
• a dielectric cooling liquid within the interior space and submerging the heat generating electronic computer component in direct contact therewith;
• a pump within the interior space and submerged in the dielectric cooling liquid, the pump having an inlet in communication with the dielectric cooling liquid, and an outlet, the pump is not mounted on the circuit board;
• a heat exchanger that is not external to the sealed, liquid-tight enclosure, the heat exchanger is configured to receive warm dielectric cooling liquid, and the heat exchanger is configured to cool the warm dielectric cooling liquid;
• the heat exchanger having an outlet through which cooled dielectric cooling liquid is output;
• and
• a manifold within the sealed, liquid-tight enclosure and not overlapping the upper surface of and not affixed to the circuit board, the manifold is positioned closer to the second end wall than it is to the first end wall, the manifold is in fluid communication with the outlet of the heat exchanger to receive the cooled dielectric liquid therefrom, the manifold includes a plurality of outlets with at least one of the outlets directing a returning flow of the cooled dielectric liquid onto the submerged heat generating electronic computer component or directly onto a heat sink that is fixed to the submerged heat generating electronic computer component.