Dielectric copolymer materials
AssigneeMerck Patent GmbH
InventorsGregor LARBIG, Pawel MISKIEWICZ
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Abstract
The present invention relates to a polymerizable mixture which can be used to form a dielectric material for the preparation of passivation layers in electronic devices. The polymerizable mixture comprises a first monomer and a second monomer which may react to form a copolymer providing excellent film forming capability, excellent thermal properties and excellent mechanical properties. There is further provided a method for forming said copolymers and an electronic device containing said copolymers as dielectric material. Beyond that, the present invention relates to a manufacturing method for preparing a packaged microelectronic structure and to a microelectronic device comprising said packaged microelectronic structure formed by said manufacturing method.
Claims17
Polymerizable mixture comprising a first monomer and a second monomer,
- wherein the first monomer is one or more compound represented by Formula (1), and
- wherein the second monomer is one or more bi- or multifunctional compound capable of reacting with the first monomer to give a copolymer:
- P1-Sp1-(MG-Sp1)m-P1 Formula (1)
- wherein:
- m is an integer from 1 to 60;
- P1 denotes
- Sp1 denotes at each occurrence a spacer group (Sp) or a single bond;
- MG is a rod-shaped mesogenic group, which is preferably selected from Formula (2):
- -(A21-Z21)k-A22-(Z22-A23)l- Formula (2)
- wherein:
- A21 to A23 are independently and at each occurrence independently of one another an aryl group, heteroaryl group, heterocyclic group, alicyclic group or cyclic imide group optionally being substituted by one or more identical or different groups L;
- Z21 and Z22 are independently and at each occurrence independently from each other, —O—, —S—, —CO—, —COO—, —OCO—, —S—CO—, —CO—S—, —O—COO—, —CO—NR01—, —NR01—C)—, —NR01—CO—NR02, —NR01—CO—O—, —O—CO—NR01——OCH2—, —CH2O—, —SCH2—, —CH2S—, —CF2O—, —OCF2—, —CF2S—, —SCF2—, —CH2CH2—, —(CH2)4—, —CF2CH2—, —CH2CF2—, —CF2CF2—, —CH═N—, —N═CH—, —N═N—, —CH═CR01—, —CY01═CY02—, —C≡C—, —CH′CH—COO—, —OCO—CH═CH—, or a single bond;
- R01 and R02 each, independently of one another, denote H or alkyl having 1 to 12 C atoms;
- L is F, Cl, Br, I, —CN, —NO2, —NCO, —NCS, —OCN, —SCN, —C(═O)NRxxRyy, —C(═O)ORxx, —C(═O)Rxx, —NRxxRyy, —OH, —SF5, or straight chain or branched chain alkyl, alkoxy, alkylcarbonyl, alkoxycarbonyl, alkylcarbonyloxy or alkoxycarbonyloxy with 1 to 20 C atoms, wherein one or more H atoms are optionally replaced by F or Cl, —CN or straight chain or branched chain alkyl, alkoxy, alkylcarbonyl, alkoxycarbonyl, alkylcarbonyloxy or alkoxycarbonyloxy with 1 to 6 C atoms;
- Rxx and Ryy independently of each other denote H or alkyl with 1 to 12 C-atoms;
- Y01 and Y02 each, independently of one another, denote H, alkyl having 1 to 12 C atoms, aryl, F, Cl, or CN;
- and
- k and l are each and independently 0, 1, 2, 3 or 4.
Dependencies are inferred from the claim text.