Conductive adhesive and a bonding method of circuit board
AssigneeWuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
InventorsSiheng GAO, Jinlong TAN
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Abstract
A conductive adhesive and a bonding method of circuit board are provided. The conductive adhesive includes a substrate and an insulating region formed on a surface of the substrate and a conductive region. The insulating region includes a plurality of insulating retaining walls arranged along a same direction and in intervals. The conductive region includes a plurality of conductive adhesive bodies and the conductive adhesive bodies are filled in gaps between the adjacent insulating retaining walls.
Claims16
A conductive adhesive, comprising:
- a substrate, an insulating region formed on a surface of the substrate, and a conductive region;
- wherein the insulating region comprises a plurality of insulating retaining walls arranged along a same direction and in intervals, the conductive region comprises a plurality of conductive adhesive bodies, the conductive adhesive bodies fill in gaps between the adjacent insulating retaining walls, and the insulating retaining walls are made of insulating resin.
A bonding method of circuit board, comprising:
- step s10:
- providing a substrate, the substrate comprising a bonding area and a plurality of first terminals distributed with intervals on a surface of the bonding area;
- step s20:
- coating a photoresist layer on the bonding area, the photoresist layer comprising a first photoresist, and a second photoresist, and utilizing a first goal photomask to expose, etch, and develop to etch off the first photoresist while the second photoresist is remained, wherein the first photoresist is coated on the first terminals and the second photoresist is coated between the first terminals;
- step s30:
- dropping a solution containing conductive adhesive bodies to a position where the first photoresist originally exists and utilizing a heated plate to press the solution and precuring the solution to form a conductive region comprising conductive adhesive bodies distributed with intervals;
- step s40:
- utilizing a second goal photomask to expose, etch, and develop to etch off the second photoresist between the conductive adhesive bodies;
- and
- step s50:
- forming a plurality of insulating retaining walls between the adjacent conductive adhesive bodies and providing a circuit board which has thereon a plurality of second terminals disposed corresponding to the first terminals, respectively, and utilizing the heated plate to press the circuit board to complete the bonding of the circuit board after the second terminals are aligned and connected with the first terminals through the conductive adhesive bodies;
- wherein the insulating region comprises the insulating retaining walls, the conductive region comprises the conductive adhesive bodies and the conductive adhesive bodies are formed in the gaps between the adjacent insulating retaining walls.
A conductive adhesive, comprising a substrate, an insulating region formed on a surface of the substrate and a conductive region;
- wherein the insulating region comprises a plurality of insulating retaining walls arranged along a same direction and in intervals;
- the conductive region comprises a plurality of conductive adhesive bodies;
- and the conductive adhesive bodies filled in gaps between the adjacent insulating retaining walls.
Dependencies are inferred from the claim text.