# US 2021/0345524 A1 · Variable temperature heat exchange switch > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2021/0345524 A1 - Document ID: US20210345524A1 - Status: Published application - Kind: A1 - Application number: 16/863,777 - Filed: 2020-04-30 - Published: 2021-11-04 - Earliest claimed: 2020-04-30 - Assignees: Lenovo (Singapore) Pte. Ltd. - Applicants: LENOVO (Singapore) PTE. LTD. - Inventors: Bouziane Yebka; Philip Jakes; Tin-Lup Wong - Web page: https://patentgrep.com/patent/US20210345524A1 ## CPC - H05K 7/20381: {Thermal management, e.g. evaporation control} - H05K 7/20336: {Heat pipes, e.g. wicks or capillary pumps} - H05K 7/20154: {Heat dissipaters coupled to components} - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract Apparatuses, systems, devices, and methods for variable temperature heat exchange switch are disclosed. An apparatus includes a heat exchanger coupled to an electronic component to dissipate heat from the electronic component. The apparatus includes a heat pipe connected to the heat exchanger and configured to dissipate heat. An apparatus includes a thermal-activated switch located at the connection between the heat exchanger and the heat pipe. The thermal-activated switch may be configured to allow heat transfer from the heat exchanger to the heat pipe in response to a temperature satisfying a threshold temperature. ## Claims ### Claim 1 An apparatus, comprising: a heat exchanger coupled to an electronic component to dissipate heat from the electronic component; a heat pipe connected to the heat exchanger and configured to dissipate heat; and a thermal-activated switch coupled between the heat exchanger and the heat pipe, the thermal-activated switch comprising: a first side coupled to the heat exchanger, a second side coupled to the heat pipe, a gap between the first side and the second side, and a thermally conductive material comprising a curved shape including a first end coupled to the first side and a second end coupled to the first side, the thermally conductive material configured to pivot around the first end and the second end to orient the curved shape toward the first side coupled to the heat exchanger in response to heat at the heat exchanger being less than a predetermined threshold amount of heat at the heat exchanger, and to orient the curved shape toward the second side coupled to the heat pipe to transfer heat from the heat exchange to the heat pipe in response to the heat at the heat exchanger being at least the predetermined threshold amount of heat. ### Claim 2 (canceled) ### Claim 3 (canceled) ### Claim 4 (canceled) ### Claim 5 (canceled) ### Claim 6 (depends on 1) The apparatus of claim 1, wherein the thermally conductive material forms a bi-metallic snap switch that snaps the curved shape between the first side and the second side to create thermal contact between the heat exchanger and the heat pipe in response to the heat at the heat exchanger being less than at least the predetermined threshold amount of heat or at least the predetermined threshold amount of heat. ### Claim 7 (depends on 1) The apparatus of claim 1, wherein the thermal-activated switch is a one-way switch such that heat is transferred from the heat exchanger to the heat pipe and not from the heat pipe to the heat exchanger. ### Claim 8 (depends on 1) The apparatus of claim 1, wherein the heat exchanger substantially covers an external surface area of the electronic component. ### Claim 9 (depends on 1) The apparatus of claim 1, wherein the heat exchanger comprises one of a heat spreader and a heat sink. ### Claim 10 (depends on 1) The apparatus of claim 1, wherein the heat exchanger is designed based on a heat map of the electronic component such that the heat exchanger is configured to dissipate more heat from hotter areas of the electronic component than cooler areas. ### Claim 11 (depends on 10) The apparatus of claim 10, wherein the heat exchanger is designed such that portions of the heat exchanger that cover hotter areas of the electronic component are thicker than other portions of the heat exchanger that cover cooler areas of the electronic component. ### Claim 12 (canceled) ### Claim 13 (canceled) ### Claim 14 (canceled) ### Claim 15 (depends on 1) The apparatus of claim 1, wherein the electronic component is free of a fan for dissipating heat. ### Claim 16 A system, comprising: an electronic component; a heat exchanger coupled to the electronic component to dissipate heat from the electronic component; a heat pipe configured to dissipate heat; a thermal-activated switch coupled between the heat exchanger and the heat pipe, the thermal-activated switch comprising a first side coupled to the heat exchanger, a second side coupled to the heat pipe, and a gap between the first side and the second side, and further comprising one of: a first thermally conductive material located at the first side, the first thermally conductive material configured to expand to fill the gap between the first side and the second side to thermally couple the heat exchanger and the heat pipe in response to a predetermined threshold amount of heat at the heat exchanger, or a second thermally conductive material comprising a curved shape including a first end coupled to the first side and a second end coupled to the first side, the second thermally conductive material configured to pivot around the first end and the second end to orient the curved shape toward the first side coupled to the heat exchanger in response to heat at the heat exchanger being less than the predetermined threshold amount of heat, and to orient the curved shape toward the second side coupled to the heat pipe to transfer heat from the heat exchanger to the heat pipe in response to the heat at the heat exchanger being at least the predetermined threshold amount of heat, wherein the thermally conductive material in the second position creates a contact between the heat exchanger and the heat pipe. ### Claim 17 (canceled) ### Claim 18 (canceled) ### Claim 19 (canceled) ### Claim 20 (canceled) ### Claim 21 (depends on 16) The apparatus of claim 16, wherein the first thermally conductive material comprises one of chlorinated polyvinyl chloride, polyvinyl chloride, carbon steel, stainless steel, and fiberglass. ### Claim 22 (depends on 16) The system of claim 16, wherein each second thermally conductive material forms a bi-metallic snap switch that snaps the curved shape between the first end and the second end to create respective thermal contact between the first heat exchanger and the heat pipe and the second heat exchanger and the heat pipe in response to the respective heat at the first heat exchanger and the second heat exchanger being less than at least the predetermined threshold amount of heat or at least the predetermined threshold amount of heat. ### Claim 23 An apparatus, comprising: a heat exchanger coupled to an electronic component to dissipate heat from the electronic component; a heat pipe coupled to the heat exchanger and configured to dissipate heat; and a thermal-activated switch coupled between the heat exchanger and the heat pipe, the thermal-activated switch comprising: a first side coupled to the heat exchanger, a second side coupled to the heat pipe, a gap between the first side and the second side, and a thermally conductive material located at the first side, the thermally conductive material configured to expand to fill the gap between the first side and the second side to thermally couple the heat exchanger and the heat pipe in response to a predetermined threshold amount of heat at the heat exchanger. ### Claim 24 (depends on 23) The apparatus of claim 23, wherein the thermally conductive material comprises one of chlorinated polyvinyl chloride, polyvinyl chloride, carbon steel, stainless steel, and fiberglass. ### Claim 25 (depends on 23) The apparatus of claim 23, wherein the thermal-activated switch is a one-way switch such that heat is transferred from the heat exchanger to the heat pipe and not from the heat pipe to the heat exchanger. ### Claim 26 (depends on 23) The apparatus of claim 23, wherein the heat exchanger substantially covers an external surface area of the electronic component. ### Claim 27 (depends on 23) The apparatus of claim 23, wherein the heat exchanger comprises one of a heat spreader and a heat sink. ### Claim 28 (depends on 23) The apparatus of claim 23, wherein the heat exchanger is designed based on a heat map of the electronic component such that the heat exchanger is configured to dissipate more heat from hotter areas of the electronic component than cooler areas. ### Claim 29 (depends on 28) The apparatus of claim 28, wherein the heat exchanger is designed such that portions of the heat exchanger that cover hotter areas of the electronic component are thicker than other portions of the heat exchanger that cover cooler areas of the electronic component. ### Claim 30 (depends on 23) The apparatus of claim 23, wherein the electronic component is free of a fan for dissipating heat. ### Claim 31 (depends on 1) The apparatus of claim 1, wherein the thermally conductive material in the second position creates a contact between the heat exchanger and the heat pipe.