# US 2021/0345518 A1 · Device and heat radiation method > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2021/0345518 A1 - Document ID: US20210345518A1 - Status: Published application - Kind: A1 - Application number: 17/281,993 - Filed: 2019-09-11 - Published: 2021-11-04 - Earliest claimed: 2018-10-04 - Assignees: Showa Denko Materials Co., Ltd. - Applicants: Showa Denko Materials Co., Ltd. - Inventors: Maki TAKAHASHI; Takashi ANDOU; Yoshitaka TAKEZAWA; Takanobu KOBAYASHI; Naoki MARUYAMA - Web page: https://patentgrep.com/patent/US20210345518A1 ## CPC - C09K 5/14: Solid materials, e.g. powdery or granular - F28D 15/02: in which the medium condenses and evaporates, e.g. heat pipes {(heat pipes used in solar heat collectors F24S10/95; in radiators F28D1/0226; in nuclear reactors G21C15/257)} - B32B 37/24: with at least one layer not being coherent before laminating, e.g. made up from granular material sprinkled onto a substrate (B32B37/15 takes precedence) - C08K 3/08: Metals - C23C 24/00: Coating starting from inorganic powder (spraying of the coating material in molten state C23C4/00; solid state diffusion C23C8/00 - C23C12/00) - C23C 26/00: Coating not provided for in groups C23C2/00 - C23C24/00 - C23C 30/00: Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process (C23C26/00, C23C28/00 take precedence) - F28F 21/089: {Coatings, claddings or bonding layers made from metals or metal alloys (F28F19/06 takes precedence)} - H05K 1/0203: {Cooling of mounted components (H05K1/0272 takes precedence)} - H05K 7/2039: {characterised by the heat transfer by conduction from the heat generating element to a dissipating body (arrangements for increasing/decreasing heat-transfer, e.g. fins details, F28F13/00)} - H05K 7/20427: {having radiation enhancing surface treatment, e.g. black coating} - B32B 2037/243: {Coating} - B32B 2255/10: on synthetic resin layer or on natural or synthetic rubber layer - B32B 2255/205: Metallic coating - B32B 2264/105: Metal - B32B 2307/30: having particular thermal properties - C08K 2003/085: {Copper} - F28F 2013/001: {Particular heat conductive materials, e.g. superconductive elements} - H10H 20/8581: {characterised by their material} - H10W 40/251: {Organics} - C09K: MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE - F28D: HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT (fluid heaters having heat generating means and heat transferring means F24H; furnaces F27; details of heat-exchange apparatus of general) - B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM - C08K: Use of inorganic or non-macromolecular organic substances as compounding ingredients (paints, inks, varnishes, dyes, polishes, adhesives C09) - C23C: COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion B21C23/22; covering with metal by connecting pre-existing layers to articles, see the relevant places, e.g. B21D39/00, B23K; metallising of glass C03C; metallising mortars, concrete, artificial stone, ceramics or natural stone C04B41/00; enamelling of, or applying a vitreous layer to, metals C23D; treating metal surfaces or coating of metals by electrolysis or electrophoresis C25D; single-crystal film growth C30B; by metallising textiles D06M11/83; decorating textiles by locally metallising D06Q1/04) - F28F: DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION (water and air traps, air venting F16) - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A device which includes a heat generator, a resinous housing covering the heat generator, and a heat radiation material disposed on at least some of the surfaces of the heat generator, wherein the heat radiation material includes metal particles and a resin and has a region where the metal particles arranged along the surface direction are present at a relatively high density. ## Claims ### Claim 1 A device comprising: a heat generator; a resinous housing covering the heat generator; and a heat radiation material disposed on at least some of a surface of the heat generator, wherein the heat radiation material contains metal particles and a resin and has a region in which the metal particles arranged in a surface direction are present at a relatively high density. ### Claim 2 (depends on 1) The device according to claim 1, wherein the heat generator is an electronic component, and wherein the device further comprises: a circuit board on which the electronic component is mounted; and the heat radiation material disposed on at least some of a surface of the circuit board. ### Claim 3 (depends on 1) The device according to claim 1, wherein a thickness of the heat radiation material is in a range of 0.1 μm to 100 μm. ### Claim 4 (depends on 1) The device according to claim 1, wherein a proportion of a thickness of the region in a total thickness of the heat radiation material is in a range of 0.02% to 99%. ### Claim 5 (depends on 1) The device according to claim 1, wherein the region has an uneven structure derived from the metal particles on a surface thereof. ### Claim 6 (depends on 1) The device according to claim 1, wherein the heat radiation material comprises a region 1 and a region 2, and the region 1 and the region 2 are satisfying the following (A) and (B): (A) a total value of absorption of electromagnetic waves at a wavelength of 2 μm to 6 μm in the region 1>a total value of absorption of electromagnetic waves at a wavelength of 2 μm to 6 μm in the region 2, and (B) a metal particle occupancy rate in the region 1>a metal particle occupancy rate in the region 2. ### Claim 7 (depends on 1) The device according to claim 1, wherein the heat radiation material comprises a region 1, a region 2, and a region 3, and the region 1, the region 2, and the region 3 are satisfying the following (A) and (B): (A) a total value of absorption of electromagnetic waves at a wavelength of 2 μm to 6 μm in the region 2>a total value of absorption of electromagnetic waves at a wavelength of 2 μm to 6 μm in the region 1 and the region 3, and (B) a metal particle occupancy rate in the region 2>metal particle occupancy rates in the region 1 and the region 3. ### Claim 8 (depends on 1) The device according to claim 1, wherein a total value of absorption of electromagnetic waves at a wavelength of 2 μm to 6 μm in the heat radiation material is larger than a total value of absorption of electromagnetic waves at a wavelength of 2 μm to 6 μm in the resinous housing. ### Claim 9 A device comprising: a heat generator; a resinous housing covering the heat generator; and a heat radiation material disposed on at least some of a surface of the heat generator, wherein the heat radiation material has a base material layer that contains a resin and has an uneven structure on at least one surface thereof and a metal layer that is disposed on the surface side of the base material layer having the uneven structure and has a shape corresponding to the uneven structure. ### Claim 10 A device comprising: a heat generator; a resinous housing covering the heat generator; and a heat radiation material disposed on at least some of a surface of the heat generator, wherein the heat radiation material has a resin layer and a metal pattern layer comprising a region A in which a metal is present and a region B in which a metal is not present. ### Claim 11 A heat radiation method comprising: a step of disposing a heat radiation material on at least some of a surface of a heat generator covered with a resinous housing, wherein the heat radiation material contains metal particles and a resin and has a region where the metal particles arranged in a surface direction are present at a relatively high density. ### Claim 12 (depends on 2) The device according to claim 2, wherein a thickness of the heat radiation material is in a range of 0.1 μm to 100 μm. ### Claim 13 (depends on 2) The device according to claim 2, wherein a proportion of a thickness of the region in a total thickness of the heat radiation material is in a range of 0.02% to 99%. ### Claim 14 (depends on 3) The device according to claim 3, wherein a proportion of a thickness of the region in a total thickness of the heat radiation material is in a range of 0.02% to 99%. ### Claim 15 (depends on 2) The device according to claim 2, wherein the region has an uneven structure derived from the metal particles on a surface thereof. ### Claim 16 (depends on 3) The device according to claim 3, wherein the region has an uneven structure derived from the metal particles on a surface thereof. ### Claim 17 (depends on 4) The device according to claim 4, wherein the region has an uneven structure derived from the metal particles on a surface thereof. ### Claim 18 (depends on 2) The device according to claim 2, wherein the heat radiation material comprises a region 1 and a region 2, and the region 1 and the region 2 are satisfying the following (A) and (B): (A) a total value of absorption of electromagnetic waves at a wavelength of 2 μm to 6 μm in the region 1>a total value of absorption of electromagnetic waves at a wavelength of 2 μm to 6 μm in the region 2, and (B) a metal particle occupancy rate in the region 1>a metal particle occupancy rate in the region 2. ### Claim 19 (depends on 3) The device according to claim 3, wherein the heat radiation material comprises a region 1 and a region 2, and the region 1 and the region 2 are satisfying the following (A) and (B): (A) a total value of absorption of electromagnetic waves at a wavelength of 2 μm to 6 μm in the region 1>a total value of absorption of electromagnetic waves at a wavelength of 2 μm to 6 μm in the region 2, and (B) a metal particle occupancy rate in the region 1>a metal particle occupancy rate in the region 2. ### Claim 20 (depends on 4) The device according to claim 4, wherein the heat radiation material comprises a region 1 and a region 2, and the region 1 and the region 2 are satisfying the following (A) and (B): (A) a total value of absorption of electromagnetic waves at a wavelength of 2 μm to 6 μm in the region 1>a total value of absorption of electromagnetic waves at a wavelength of 2 μm to 6 μm in the region 2, and (B) a metal particle occupancy rate in the region 1>a metal particle occupancy rate in the region 2.