# US 2021/0345490 A1 · In-mold electronic component and method for manufacturing the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2021/0345490 A1 - Document ID: US20210345490A1 - Status: Published application - Kind: A1 - Application number: 17/203,451 - Filed: 2021-03-16 - Published: 2021-11-04 - Earliest claimed: 2020-04-29 - Assignees: Interface Technology (ChengDu) Co., Ltd.; Interface Optoelectronics (Shenzhen) Co., Ltd.; General Interface Solution Limited - Applicants: Interface Technology (ChengDu) Co., Ltd.; Interface Optoelectronics (Shenzhen) Co., Ltd.; General Interface Solution Limited - Inventors: Ten-Hsing JAW; Han Lung TSAI; I-chang KUAN - Web page: https://patentgrep.com/patent/US20210345490A1 ## CPC - B29C 45/14639: {for obtaining an insulating effect, e.g. for electrical components} - B32B 3/266: {characterised by an apertured layer, the apertures going through the whole thickness of the layer, e.g. expanded metal, perforated layer, slit layer regular cells B32B3/12} - B32B 27/06: as the main or only constituent of a layer, {which is} next to another layer of {the same or of} a {different material (next to a layer of a particular substance B32B9/045; next to a bituminous or tarry layer B32B11/046; next to a water setting substance layer B32B13/12; next to a metal layer B32B15/08; next to a glass layer B32B17/10; next to a layer formed of natural mineral fibres or particles B32B19/045; next to a wood layer B32B21/08; next to a cellulosic plastic layer B32B23/08; next to a natural or synthetic rubber layer B32B25/08)} - B29C 2045/14532: {injecting between two sheets} - B29C 2045/1454: {injecting between inserts not being in contact with each other} - B32B 2457/20: Displays, e.g. liquid crystal displays, plasma displays - B29C: SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING (making preforms B29B11/00; making laminated products by combining previously unconnected layers which become one product whose layers will remain together B32B37/00 - B32B41/00) - B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM ## Abstract An in-mold electronic component includes a first film layer, a functional module, a plastic layer, and a lead-out terminal. The first film layer is provided at a top surface of the in-mold electronic component. The functional module includes a circuit layer and an electronic component electrically connected to circuit layer. The plastic layer is configured to seal the functional module. One end of the lead-out terminal is electrically connected to the circuit layer, and the other end of the lead-out terminal is led out to a rear surface of the in-mold electronic component. ## Claims ### Claim 1 An in-mold electronic component, comprising: a first film layer provided at a top surface of the in-mold electronic component; a functional module comprising a circuit layer and an electronic component electrically connected to circuit layer; a plastic layer configured to seal the functional module; and a lead-out terminal, one end of the lead-out terminal being electrically connected to the circuit layer, and the other end of the lead-out terminal being led out to a rear surface of the in-mold electronic component. ### Claim 2 (depends on 1) The in-mold electronic component according to claim 1, wherein the first film layer is provided with a decorative layer on a side thereof away from the top surface. ### Claim 3 (depends on 1) The in-mold electronic component according to claim 1, wherein the electronic component comprises a display unit and a touch unit, the display unit and the touch unit are both electrically connected to the circuit layer, the top surface comprises a display area corresponding to the display unit and a touch area corresponding to the touch unit, and information generated by the display unit is displayed on the display area. ### Claim 4 (depends on 1) The in-mold electronic component according to claim 1, wherein the electronic component comprises a display unit and a touch unit, the display unit and the touch unit are both electrically connected to the circuit layer; the top surface comprises a display area and a touch area that are coincided with each other, the display unit and the touch unit are laminated, and the display unit and the touch unit are provided with an insulating layer therebetween. ### Claim 5 (depends on 4) The in-mold electronic component according to claim 4, wherein the first film layer is provided with a decorative layer on a side thereof away from the top surface, and the decorative layer is provided with a through hole at a position corresponding to the display area, light emitted by the display unit goes through the display area via the through hole. ### Claim 6 (depends on 2) The in-mold electronic component according to claim 2, wherein the electronic component comprises two display units electronically connected to the circuit layer, the top surface comprises a display area, the decorative layer is provided with a through hole at a position corresponding to the display area, light emitted by the display unit goes through the display area via the through hole, and the two display units are located on opposite sides of the through hole, respectively. ### Claim 7 (depends on 2) The in-mold electronic component according to claim 2, further comprising a second film layer provided on the rear surface of the in-mold electronic component, wherein the plastic layer is located between the first film layer and the second film layer, and the circuit layer is located at a side of the second film layer adjacent to the plastic layer. ### Claim 8 (depends on 7) The in-mold electronic component according to claim 7, wherein the electronic component comprises a display unit and a touch unit that are both electrically connected to the circuit layer, the top surface comprises a display area and a touch area that are coincided with each other, the display unit and the touch unit are laminated, and the display unit and the touch unit are provided with an insulating layer therebetween. ### Claim 9 (depends on 7) The in-mold electronic component according to claim 7, wherein the electronic component comprises two display units that are electronically connected to the circuit layer, the top surface comprises a display area, the decorative layer is provided with a through hole at a position corresponding to the display area, light emitted by the display unit goes through the display area via the through hole, the two display units are located on opposite sides of the through hole, respectively; or the display units are located below the through hole. ### Claim 10 (depends on 7) The in-mold electronic component according to claim 7, wherein the second film layer is provided with a via hole, the lead-out terminal comprises a flexible printed circuit and a conductive material filled in the via hole, one end of the conductive material is electrically connected to the circuit layer, and the other end of the conductive material is electrically connected to the flexible printed circuit. ### Claim 11 (depends on 1) The in-mold electronic component according to claim 1, wherein the circuit layer is located at a side of the first film layer away from the top surface, the plastic layer is located on a side of the circuit layer away from the first film layer and is configured to seal the decorative layer, the circuit layer, and the electronic component. ### Claim 12 (depends on 1) The in-mold electronic component according to claim 1, wherein the first film layer is provided with a decorative layer on a side thereof away from the top surface, the circuit layer is provided on a side of the decorative layer away from the first film layer, the plastic layer is located on a side of the circuit layer away from the decorative layer and is configured to seal the decorative layer, the functional module, and a part of the lead-out terminal. ### Claim 13 (depends on 12) The in-mold electronic component according to claim 12, wherein the lead-out terminal is a pin header comprising a connecting pin electrically connected to the circuit layer and a pin head extending through the plastic layer, and the pin head protrudes from the rear surface of the in-mold electronic component. ### Claim 14 (depends on 13) The in-mold electronic component according to claim 13, wherein the connecting pin and a part of the pin head are embedded in the plastic layer. ### Claim 15 (depends on 12) The in-mold electronic component according to claim 12, wherein the lead-out terminal comprises a connecting pin, a coil portion, and a protective shell, the connecting pin is electrically connected to the coil portion, the coil portion forms an insertion hole therein, the protective shell is sleeved on the coil portion, the protective shell protrudes from the plastic layer and protrudes from the rear surface of the in-mold electronic component. ### Claim 16 A method for manufacturing an in-mold electronic component, comprising: printing a decorative layer on a side of a first film layer; forming a hole in a second film layer, and filling the hole with a conductive material; printing a circuit layer and a conductive layer on a side of the second film layer, and patterning the conductive layer to form a touch unit electrically connected to the circuit layer, the circuit layer being electrically connected to the conductive material; electrically connecting a display unit to the circuit layer; forming a plastic layer between the first film layer and the second film layer through an injection molding process, the plastic layer being configured to seal the decorative layer, the circuit layer, the display unit, and the touch unit; and binding an end of the conductive material away from the circuit layer to a flexible printed circuit. ### Claim 17 (depends on 16) The method according to claim 16, wherein the display unit, the touch unit, and the circuit layer are formed on a side of the second film layer adjacent to the plastic layer. ### Claim 18 (depends on 17) The method according to claim 17, wherein the decorative layer is provided with a through hole, two display units are located on opposite sides of the through hole, respectively; or the display units are located below the through hole. ### Claim 19 A method for manufacturing an in-mold electronic component, comprising: printing a decorative layer on a side of a first film layer; printing a circuit layer and a conductive layer on the decorative layer, and patterning the conductive layer to form a touch unit electrically connected to the circuit layer; electrically connecting a display unit to the circuit layer, and fixing a connecting pin of a pin header to the circuit layer; and forming a plastic layer on a side of the circuit layer away from the first film layer through an injection molding process, and enabling a pin head of the pin header to protrude from the plastic layer. ### Claim 20 (depends on 19) The method according to claim 19, wherein the decorative layer is provided with a through hole, two display units are located on opposite sides of the through hole, respectively; or the display units are located below the through hole.