# US 2021/0345489 A1 · Horizontally mounted capacitor module and electronic device including same

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 2021/0345489 A1
- Document ID: US20210345489A1
- Status: Published application
- Kind: A1
- Application number: 17/225,209
- Filed: 2021-04-08
- Published: 2021-11-04
- Earliest claimed: 2020-04-29
- Assignees: Samsung Electronics Co., Ltd.
- Applicants: Samsung Electronics Co., Ltd.
- Inventors: CHUNGHYUN RYU; BYUNGOK KANG; SU-YONG AN; JONGWOO JANG; INSUB KWAK; TECK SU OH; GEURIM JUNG; SANG-HO PARK; SUNG-KI LEE
- Web page: https://patentgrep.com/patent/US20210345489A1

## CPC

- H05K 1/182: associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
- H01G 9/06: Mounting in containers
- H01G 9/08: Housing; Encapsulation
- H01G 9/008: Terminals
- H01G 9/045: based on aluminium
- H01G 9/14: Structural combinations {or circuits} for modifying, or compensating for, electric characteristics of electrolytic capacitors
- H05K 2201/09063: Holes or slots in insulating substrate not used for electrical connections
- H05K 2201/09781: Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
- H05K 2201/10015: Non-printed capacitor
- H05K 2201/10606: Permanent holder for component or auxiliary printed circuits mounted on a printed circuit board [PCB]
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H01G: CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE (selection of specified materials as dielectric H01B3/00; capacitors having potential barriers H10D1/62, H10K10/10)

## Abstract

A capacitor module configured to be horizontally mounted on a PCB and including; a case including a first side surface, an opposing second side, a first electrode pad and a second electrode pad disposed at the first side surface, and a third electrode pad disposed at the second side surface, and an electrolytic capacitor including a dielectric extending in a first horizontal direction, a first electrode contacting the first electrode pad and a second electrode contacting the second electrode pad, wherein the first electrode pad is spaced apart from second electrode pad in a second horizontal direction.

## Claims

### Claim 1

A capacitor module, comprising:
a case, horizontally mounted on a printed circuit board (PCB) having principal surfaces horizontally extending in a first direction and a second direction perpendicular to the first direction, and including a first side surface, a second side surface opposing the first side surface, a first electrode pad and a second electrode pad disposed at the first side surface, and a third electrode pad disposed at the second side surface; and
an electrolytic capacitor including a dielectric extending in the first direction, a first electrode electrically connected to the first electrode pad and a second electrode electrically connected to the second electrode pad,
wherein the second electrode pad is spaced apart from the first electrode pad in the second direction.

### Claim 2 (depends on 1)

The capacitor module of claim 1, wherein one of the first electrode and the second electrode is an anode of the electrolytic capacitor, and the other one of the first electrode and the second electrode is a cathode of the electrolytic capacitor.

### Claim 3 (depends on 1)

The capacitor module of claim 1, wherein at least one of the first electrode pad and the second electrode pad is configured to mechanically support the capacitor module when mounted on the PCB.

### Claim 4 (depends on 1)

The capacitor module of claim 1, wherein the third electrode pad is a dummy electrode pad configured to mechanically support the capacitor module when the capacitor module is mounted on the PCB.

### Claim 5 (depends on 4)

The capacitor module of claim 4, wherein the third electrode pad is floated.

### Claim 6 (depends on 4)

The capacitor module of claim 4, wherein the third electrode pad is grounded.

### Claim 7 (depends on 6)

The capacitor module of claim 6, wherein one of the first electrode and the second electrode is a cathode of the electrolytic capacitor, and the third electrode pad is electrically connected with the cathode.

### Claim 8 (depends on 1)

The capacitor module of claim 1, wherein the case further includes:
a third side surface connecting the first side surface and the second side surface; and
a fourth electrode pad disposed at the third side surface.

### Claim 9 (depends on 8)

The capacitor module of claim 8, wherein each of the third electrode pad and the fourth electrode pad is a dummy electrode pad configured to mechanically support the capacitor module when the capacitor module is mounted on the PCB.

### Claim 10 (depends on 9)

The capacitor module of claim 9, wherein each of the third electrode pad and the fourth electrode pad is connected to be floated or be grounded.

### Claim 11

An electronic device comprising:
a printed circuit board (PCB) having principal surfaces horizontally extending in a first direction and a second direction perpendicular to the first direction and including a mounting area, a first contact terminal, a second contact terminal and a third contact terminal;
a case configured to be horizontally mounted on the PCB at least partially within the mounting area and including a first side surface, a second side surface opposing the first side surface, a first electrode pad and a second electrode pad disposed at the first side surface, and a third electrode pad disposed at the second side surface; and
an electrolytic capacitor including a dielectric extending in the first direction, a first electrode and a second electrode spaced apart from the first electrode in the second direction,
wherein the electrolytic capacitor is mounted on the case by connecting the first electrode to the first electrode pad and connecting the second electrode to the second electrode pad, and
the case is horizontally mounted within the mounting area of the PCB by connecting the first electrode pad to the first contact terminal, the second electrode pad to the second contact terminal, and the third electrode pad to the third contact terminal.

### Claim 12 (depends on 11)

The electronic device of claim 11, wherein one of the first electrode and the second electrode is an anode of the electrolytic capacitor, and the other one of the first electrode and the second electrode is a cathode of the electrolytic capacitor.

### Claim 13 (depends on 11)

The electronic device of claim 11, wherein the third electrode pad is a dummy electrode pad configured to mechanically support the case when the case is horizontally mounted on the PCB.

### Claim 14 (depends on 11)

The electronic device of claim 11, wherein the PCB further includes a fourth contact terminal,
the case further includes a third side surface connecting the first side surface and the second side surface and a fourth electrode pad connected to the third side surface, and
the case is horizontally mounted within the mounting area of the PCB by further connecting the fourth electrode pad to the fourth contact terminal.

### Claim 15 (depends on 14)

The electronic device of claim 14, wherein the third electrode pad and the fourth electrode pad are dummy electrode pads configured to mechanically support the case when mounted on the PCB, and
the each of the third electrode pad and the fourth electrode pad is connected to be floated or be grounded.

### Claim 16 (depends on 11)

The electronic device of claim 11, wherein the mounting area is disposed within the PCB to receive and mount the case in one of a lengthwise manner and a widthwise manner.

### Claim 17 (depends on 11)

The electronic device of claim 11, further comprising:
a cover case that substantially encompasses at least one of an upper surface of the PCB and a lower surface of the PCB.

### Claim 18

A capacitor module configured to be horizontally mounted on a printed circuit board (PCB), the PCB having an upper surface and a lower surface horizontally extending in a first direction and a second direction perpendicular to the first direction, the capacitor module comprising:
a case including a frame, a first side surface, a second side surface opposing the first side surface, a third side surface connecting the first and second side surfaces, a first electrode pad and a second electrode pad disposed at the first side surface, and a third electrode pad disposed at the third side surface; and
a cylindrical electrolytic capacitor including a dielectric extending in the first direction, a first electrode contacting the first electrode pad and a second electrode contacting the second electrode pad,
wherein the first electrode pad is spaced apart from second electrode pad in the second direction, and the frame substantially surrounds side surfaces of the cylindrical electrolytic capacitor.

### Claim 19 (depends on 18)

The capacitor module of claim 18, wherein one of the first electrode and the second electrode is an anode of the cylindrical electrolytic capacitor, and the other one of the first electrode and the second electrode is a cathode of the cylindrical electrolytic capacitor, and
the third electrode pad is a dummy electrode pad configured to mechanically support the capacitor module when mounted on the PCB.

### Claim 20 (depends on 18)

The capacitor module of claim 18, wherein the cylindrical electrolytic capacitor is an aluminum electrolytic capacitor.
