# US 2021/0345481 A1 · Integral super-capacitor for low power applications > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2021/0345481 A1 - Document ID: US20210345481A1 - Status: Published application - Kind: A1 - Application number: 16/862,130 - Filed: 2020-04-29 - Published: 2021-11-04 - Earliest claimed: 2020-04-29 - Assignees: QUALCOMM Incorporated - Applicants: QUALCOMM Incorporated - Inventors: Mohit Kishore PRASAD; Lalan Jee MISHRA - Web page: https://patentgrep.com/patent/US20210345481A1 ## CPC - H05K 1/0231: {Capacitors or dielectric substances} - H05K 3/4602: {characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated} - H01G 2/065: {for surface mounting, e.g. chip capacitors} - H01G 4/018: Dielectrics - H01G 4/1227: {based on alkaline earth titanates} - H01G 4/232: electrically connecting two or more layers of a stacked or rolled capacitor - H01G 4/33: Thin- or thick-film capacitors {(thin- or thick-film circuits; capacitors without a potential-jump or surface barrier specially adapted for integrated circuits, details thereof, multistep manufacturing processes therefor)} - H01G 4/40: Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations - H02J 7/90: Regulation of charging or discharging current or voltage - H05K 1/162: {incorporating printed capacitors} - H05K 2201/0187: with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties - H05K 2201/0195: Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure - Y02E 60/13: Energy storage using capacitors - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H01G: CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE (selection of specified materials as dielectric H01B3/00; capacitors having potential barriers H10D1/62, H10K10/10) - H02J: ELECTRIC POWER NETWORKS; CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY - Y02E: REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION ## Abstract Certain aspects of the present disclosure generally relate to an electronic device with a circuit board having one or more super-capacitors implemented therein using the layers of the circuit board. An example electronic device generally includes a circuit board having a capacitive element implemented therein, wherein the capacitive element comprises a first conductive layer, a second conductive layer disposed below the first conductive layer, and a solid dielectric material disposed between the first and second conductive layers, wherein the dielectric material has a high dielectric constant greater than 10,000 (1E4); and an integrated circuit coupled to the circuit board. ## Claims ### Claim 1 An electronic device comprising: a circuit board having a capacitive element implemented therein, wherein the capacitive element comprises a first conductive layer, a second conductive layer disposed below the first conductive layer, and a solid dielectric material disposed between the first and second conductive layers, wherein the dielectric material has a high dielectric constant greater than 10,000 (1E4); and an integrated circuit coupled to the circuit board. ### Claim 2 (depends on 1) The device of claim 1, wherein the dielectric constant of the dielectric material is in a range from 100,000,000 (1E8) to 1,000,000,000 (1E9). ### Claim 3 (depends on 2) The device of claim 2, wherein the dielectric material comprises calcium copper titanate (CaCuTiO2). ### Claim 4 (depends on 1) The device of claim 1, wherein the first and second conductive layers are separated from each other by a distance of less than 40 μm. ### Claim 5 (depends on 1) The device of claim 1, wherein the capacitive element spans at least one of an entire length or an entire width of the circuit board. ### Claim 6 (depends on 1) The device of claim 1, wherein: the circuit board comprises one or more additional capacitive elements disposed above the capacitive element; and each of the additional capacitive elements comprises a third conductive layer, a fourth conductive layer disposed above the third conductive layer, and another dielectric material disposed between the third conductive layer and the fourth conductive layer. ### Claim 7 (depends on 1) The device of claim 1, wherein: the circuit board comprises one or more additional capacitive elements disposed adjacent to the capacitive element; and each of the additional capacitive elements comprises a third conductive layer, a fourth conductive layer disposed above the third conductive layer, and another dielectric material disposed between the third conductive layer and the fourth conductive layer. ### Claim 8 (depends on 7) The device of claim 7, wherein the capacitive element and the one or more additional capacitive elements are electrically coupled in parallel with each other. ### Claim 9 (depends on 1) The device of claim 1, wherein the capacitive element comprises a plurality of dielectric layers disposed between the first and second conductive layers. ### Claim 10 (depends on 1) The device of claim 1, further comprising an energy harvester coupled to the circuit board and electrically coupled to the capacitive element through the circuit board, wherein the energy harvester is configured to generate an electric current for charging the capacitive element. ### Claim 11 (depends on 10) The device of claim 10, wherein the energy harvester comprises a photovoltaic energy harvester configured to convert light for generating the electric current or a radio frequency (RF) energy harvester configured to convert electromagnetic radiation at radio frequencies for generating the electric current. ### Claim 12 (depends on 10) The device of claim 10, further comprising a power management circuit coupled to the circuit board and electrically coupled to the integrated circuit and the capacitive element through the circuit board. ### Claim 13 (depends on 12) The device of claim 12, wherein the power management circuit is configured to supply power to the integrated circuit via an electric charge stored by the capacitive element. ### Claim 14 (depends on 12) The device of claim 12, further comprising a battery electrically coupled to the power management circuit. ### Claim 15 A method of fabricating an electronic device, comprising: forming a circuit board having a capacitive element implemented therein, wherein the capacitive element comprises a first conductive layer, a second conductive layer disposed above the first conductive layer, and a solid dielectric material disposed between the first and second conductive layers, wherein the dielectric material has a high dielectric constant greater than 10,000 (1E4); and coupling an integrated circuit to the circuit board. ### Claim 16 (depends on 15) The method of claim 15, wherein forming the circuit board comprises: forming the dielectric material above the first conductive layer; and forming the second conductive layer above the dielectric material, wherein the dielectric constant of the dielectric material ranges from 100,000,000 (1E8) to 1,000,000,000 (1E9), and wherein the dielectric material comprises calcium copper titanate (CaCuTiO2). ### Claim 17 (depends on 15) The method of claim 15, wherein forming the circuit board further comprises: forming additional capacitive elements above the capacitive element, wherein each of the additional capacitive elements comprises a third conductive layer, a fourth conductive layer disposed above the third conductive layer, and another dielectric material disposed between the third conductive layer and the fourth conductive layer; and electrically coupling the capacitive elements in series with each other. ### Claim 18 (depends on 15) The method of claim 15, wherein forming the circuit board further comprises: forming additional capacitive elements disposed adjacent to the capacitive element, wherein each of the additional capacitive elements comprises a third conductive layer, a fourth conductive layer disposed above the third conductive layer, and another dielectric material disposed between the third conductive layer and the fourth conductive layer; and electrically coupling the capacitive elements in parallel with each other. ### Claim 19 (depends on 15) The method of claim 15, further comprising coupling an energy harvester to the circuit board, wherein the energy harvester is electrically coupled to the capacitive element through the circuit board and configured to generate an electric current for charging the capacitive element. ### Claim 20 (depends on 19) The method of claim 19, wherein: the energy harvester comprises a photovoltaic energy harvester configured to convert light for generating the electric current or a radio frequency (RF) energy harvester configured to convert electromagnetic radiation at radio frequencies for generating the electric current; the method further comprises coupling a power management circuit to the circuit board; the power management circuit is electrically coupled to the integrated circuit and the capacitive element through the circuit board; and the power management circuit is configured to supply power to the integrated circuit via an electric charge stored by the capacitive element.