# US 2021/0345457 A1 · Heater and article equipped with heater

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- Number: US 2021/0345457 A1
- Document ID: US20210345457A1
- Status: Published application
- Kind: A1
- Application number: 17/273,493
- Filed: 2019-09-06
- Published: 2021-11-04
- Earliest claimed: 2018-09-14
- Assignees: Nitto Denko Corporation
- Applicants: Nitto Denko Corporation
- Inventors: Tetsuro HORI; Shu SASAKI; Naoko KATO; Toshihiro TSURUSAWA; Kyotaro YAMADA
- Web page: https://patentgrep.com/patent/US20210345457A1

## CPC

- H05B 3/265: {the insulating base being an inorganic material, e.g. ceramic (H05B3/262 takes precedence)}
- H05B 3/84: Heating arrangements specially adapted for transparent or reflecting areas, e.g. for demisting or de-icing windows, mirrors or vehicle windshields
- H05B 3/03: Electrodes
- H05B 3/141: {Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds}
- H05B 3/16: the conductor being mounted on an insulating base
- H05B 3/267: {the insulating base being an organic material, e.g. plastic (H05B3/262 takes precedence)}
- H05B 2203/013: Heaters using resistive films or coatings
- H05B: ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL

## Abstract

A heater (1a) includes: a substrate (10); a heat-generation layer (20) that is a conductive metal oxide layer (22); a pair of power supply electrodes (30); and a pressure-sensitive adhesive bonding laminate (40). The substrate (10) is formed of an organic polymer. The heat-generation layer (20) is disposed in contact with the substrate (10) in the thickness direction of the substrate (10). The pair of power supply electrodes (30) are electrically connected to the heat-generation layer (20). The pressure-sensitive adhesive bonding laminate (40) has a pressure-sensitive adhesive surface (41a) used for pressure-sensitive adhesive bonding with an adherend. In the pressure-sensitive adhesive bonding laminate (40), a plurality of pressure-sensitive adhesive layers (41, 42) and at least one support (45) for the plurality of pressure-sensitive adhesive layers are alternately laminated between the pressure-sensitive adhesive surface (41a) and the heat-generating layer (20).

## Claims

### Claim 1

A heater comprising:
a substrate that is formed of an organic polymer;
a heat-generating layer that is disposed in contact with the substrate in a thickness direction of the substrate, the heat-generating layer being a conductive metal oxide layer;
a pair of power supply electrodes that are electrically connected to the heat-generating layer; and
a pressure-sensitive adhesive bonding laminate that has a pressure-sensitive adhesive surface used for pressure-sensitive adhesive bonding with an adherend and in which a plurality of pressure-sensitive adhesive layers and at least one support for the plurality of pressure-sensitive adhesive layers are alternately laminated between the pressure-sensitive adhesive surface and the heat-generating layer in the thickness direction of the substrate.

### Claim 2 (depends on 1)

The heater according to claim 1, wherein
the plurality of pressure-sensitive adhesive layers include a first pressure-sensitive adhesive layer that forms the pressure-sensitive adhesive surface, and
the first pressure-sensitive adhesive layer has a thickness of 150 μm or less.

### Claim 3 (depends on 1)

The heater according to claim 1, wherein
the plurality of pressure-sensitive adhesive layers include at least one second pressure-sensitive adhesive layer that is disposed spaced apart from the pressure-sensitive adhesive surface in the thickness direction of the substrate,
the second pressure-sensitive adhesive layer has a thickness of 25 μm or more, and
the sum of thicknesses of the plurality of pressure-sensitive adhesive layers is 150 μm or more.

### Claim 4 (depends on 1)

The heater according to claim 1, wherein
an in-plane dimensional change rate Rs represented by the following formula (1) of the support is 1.0% or less:
In-plane dimensional change rate Rs=100×|S80,80−S25,50|/S25,50 (1)
where S25,50 denotes an in-plane dimension of the support in an environment at 25° C. with a relative humidity of 50%, and
S80,80 denotes an in-plane dimension of the support in an environment at 80° C. with a relative humidity of 80%.

### Claim 5 (depends on 1)

The heater according to claim 1, wherein the support has a thickness of 25 μm or more.

### Claim 6 (depends on 1)

The heater according to claim 1, wherein the pressure-sensitive adhesive bonding laminate has a thickness of 1 mm or less.

### Claim 7 (depends on 1)

The heater according to claim 1, wherein the conductive metal oxide layer is a crystalline film and has a thickness of 20 nm or more.

### Claim 8 (depends on 1)

The heater according to claim 1, wherein the pair of power supply electrodes contain a metal as a main component and have a thickness of 1 or more.

### Claim 9 (depends on 1)

The heater according to claim 1, having an average transmittance of 70% or more for light having a wavelength from 400 to 1200 nm.

### Claim 10 (depends on 1)

A heater-equipped article comprising:
an adherend; and
the heater according to claim 1, the heater being attached to the adherend with the pressure-sensitive adhesive surface being in contact with the adherend.