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US 2021/0345456 A1Published application
Narrow band infrared emitter through thermal manner
AssigneeTaiwan Nano & Micro-Photonics Co., Ltd.
InventorsChing-Fuh Lin, Chung-Hua Chao, Po-Chuan Yang
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Abstract
In some examples, an infrared emitter is provided with a heating layer sandwiched by top and bottom optical layers that allow only narrow-band infrared light to pass through. A reflective layer may be further provided below the bottom optical layers. This configuration greatly reduces the energy loss and can be manufactured with simple method and low cost.
Claims24
An infrared emitter, comprising:
- a heating layer;
- a first bandpass filter formed on an upper surface of the heating layer;
- and
- a second bandpass filter formed on a lower surface of the heating layer;
- wherein the heating layer is heated to a certain temperature and emits a light, the first bandpass filter selectively transmits a range of wavelengths Δλ1 of the light, and the second bandpass filter selectively transmitting the range of wavelengths Δλ1 or a range of wavelengths Δλ2 of the light.
2 more elements
An infrared emitter, comprising:
- a heating layer;
- a first bandpass filter formed on an upper surface of the heating layer;
- and
- a reflective layer formed on a lower surface of the heating layer;
- wherein the heating layer is heated to a certain temperature and emits a light, and the first bandpass filter selectively transmits a range of wavelengths Δλ1 of the light.
2 more elements
An infrared emitter, comprising:
- a substrate;
- a first insulating layer formed on the substrate;
- a heating layer formed on the first insulating layer;
- a second insulating layer formed on the heating layer;
- and
- an infrared light emitter formed on the second insulating layer;
- wherein the infrared light emitter comprising:
- a first metal bonding layer formed on the second insulating layer;
- a lower metal layer formed on the first metal bonding layer;
- a second metal bonding layer formed on the lower metal layer;
- a dielectric layer formed on the second metal bonding layer;
- a third metal bonding layer formed on the dielectric layer;
- an upper metal layer formed on the third metal bonding layer;
- and
- a fourth metal bonding layer formed on the upper metal layer.
12 more elements
Dependencies are inferred from the claim text.