# US 2021/0344819 A1 · Heatsinks for an image capture device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2021/0344819 A1 - Document ID: US20210344819A1 - Status: Published application - Kind: A1 - Application number: 17/378,992 - Filed: 2021-07-19 - Published: 2021-11-04 - Earliest claimed: 2020-02-27 - Assignees: GoPro, Inc. - Applicants: GoPro, Inc. - Inventors: Nicholas Vitale; Raul Vargas Gonzalez; Herman Wong - Web page: https://patentgrep.com/patent/US20210344819A1 ## CPC - H04N 23/51: Housings - G03B 17/12: with means for supporting objectives, supplementary lenses, filters, masks, or turrets - G03B 17/561: {Support related camera accessories} - H04N 23/52: Elements optimising image sensor operation, e.g. for electromagnetic interference [EMI] protection or temperature control by heat transfer or cooling elements - H04N 23/54: Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils - H04N 23/57: Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices - H05K 1/021: {Components thermally connected to metal substrates or heat-sinks by insert mounting} - H05K 1/18: structurally associated with non-printed electric components (H05K1/16 takes precedence) - G03B 17/55: with provision for heating or cooling, e.g. in aircraft - H04N: PICTORIAL COMMUNICATION, e.g. TELEVISION - G03B: APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR (optical parts of such apparatus G02B; photosensitive materials or processes for photographic purposes G03C; apparatus for processing exposed photographic materials G03D) - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract An image capture device that includes a housing and a heatsink located partially or completely within the housing. The heatsink comprises a planar surface, a printed circuit board in communication with the heatsink, and a sheet conductor that is a graphite sheet connected to the planar surface of the heatsink and in direct contact with the printed circuit board or components of the printed circuit board. ## Claims ### Claim 1 An image capture device comprising: a housing; a heatsink located partially or completely within the housing, wherein the heatsink comprises a planar surface; a printed circuit board in communication with the heatsink; and a sheet conductor that is a graphite sheet connected to the planar surface of the heatsink and in direct contact with the printed circuit board or components of the printed circuit board. ### Claim 2 (depends on 1) The image capture device of claim 1, wherein a power circuit, a microprocessor, or both are located on the printed circuit board and are in direct contact with the sheet conductor. ### Claim 3 (depends on 1) The image capture device of claim 1, wherein the sheet conductor is connected to the heatsink by a connector. ### Claim 4 (depends on 3) The image capture device of claim 3, wherein the connector is double sided tape. ### Claim 5 (depends on 1) The image capture device of claim 1, wherein the sheet conductor has a higher thermal conductivity than the heatsink. ### Claim 6 (depends on 5) The image capture device of claim 5, wherein the thermal conductivity of the sheet conductor is between about 500 Wm−1K−1 to about 2000 Wm−1K−1. ### Claim 7 (depends on 1) The image capture device of claim 1, wherein the heatsink is made of aluminum. ### Claim 8 (depends on 1) The image capture device of claim 1, further comprising a conductor that in communication with the printed circuit board and extends over the printed circuit board and the heatsink where the conductor connects to the heatsink. ### Claim 9 An image capture device comprising: a heatsink comprising: a planar surface and a cut out that are adjacent; a sheet conductor covering a portion of the planar surface of the heatsink, wherein the sheet conductor has a thickness that is less than the thickness of the heatsink and the sheet conductor is made of a material that has a higher thermal conductivity than the material of the heatsink. ### Claim 10 (depends on 9) The image capture device of claim 9, wherein the sheet conductor is connected to the planar surface by a connector. ### Claim 11 (depends on 10) The image capture device of claim 10, wherein the connector is double sided tape. ### Claim 12 (depends on 9) The image capture device of claim 9, further comprising a printed circuit board comprising a microprocessor, a power circuit, or both that are in communication with the sheet conductor. ### Claim 13 (depends on 9) The image capture device of claim 9, wherein the sheet conductor is made of a material comprising a thermal conductivity of about 500 Wm−1K−1 or more. ### Claim 14 (depends on 12) The image capture device of claim 12, further comprising a conductor that extends from a rear side of the printed circuit board to a front side of the heatsink so that heat is distributed about the heatsink. ### Claim 15 An image capture device comprising: a housing; a heatsink located partially or completely within the housing, wherein the heatsink comprises a planar surface; a printed circuit board in communication with the heatsink; a sheet conductor located between and in direct contact with the planar surface of the heatsink and the printed circuit board; and a connector connecting the sheet conductor to the heatsink. ### Claim 16 (depends on 15) The image capture device of claim 15, wherein the sheet conductor and the planar surface are substantially equal in size. ### Claim 17 (depends on 16) The image capture device of claim 16, wherein the connector covers an entire surface area of the sheet conductor, the planar surface, or both. ### Claim 18 (depends on 15) The image capture device of claim 15, further comprising a conductor that extends from a rear side of the printed circuit board to a front side of the heatsink so that heat is distributed about the heatsink. ### Claim 19 (depends on 18) The image capture device of claim 18, wherein the conductor and the sheet conductor are made of a same material. ### Claim 20 (depends on 19) The image capture device of claim 19, wherein the conductor and the sheet conductor have a thermal conductivity of about 500 Wm−1K−1 to about 2000 Wm−1K−1, and the thermal conductivity of the conductor and the sheet conductor is greater than a thermal conductivity of the heatsink.