# US 2021/0344187 A1 · Active disconnect device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2021/0344187 A1 - Document ID: US20210344187A1 - Status: Published application - Kind: A1 - Application number: 16/863,412 - Filed: 2020-04-30 - Published: 2021-11-04 - Earliest claimed: 2020-04-30 - Assignees: GM Global Technology Operations LLC - Applicants: GM Global Technology Operations LLC - Inventors: Chandra S. Namuduri; Rashmi Prasad; Thomas W. Nehl; David J. Brooks - Web page: https://patentgrep.com/patent/US20210344187A1 ## CPC - H02H 3/08: responsive to excess current (responsive to abnormal temperature caused by excess current H02H5/04) - H02H 3/087: for DC applications - H02H 3/0935: {the timing being determined by numerical means} - H05K 1/181: associated with surface mounted components - H05K 2201/10151: Sensor - H05K 2201/10166: Transistor - H02H: EMERGENCY PROTECTIVE CIRCUIT ARRANGEMENTS (indicating or signalling undesired working conditions G01R, e.g. G01R31/00, G08B; locating faults along lines G01R31/08; emergency protective devices H01H) - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract A disconnect device includes a mounting plate having a thermally conductive substrate applied onto the mounting plate. A first layer of an electrically conductive material is applied onto the substrate. A semiconductor switch supported on the first layer connects or disconnects an input power source to or from a load. A second layer of an electrically conductive material applied onto the substrate is electrically isolated from the first layer. An electronic sensing, control and protection circuit is supported on the second layer and is connected to the semiconductor switch to control operation of the semiconductor switch. A control unit in communication with the electronic sensing, control and protection circuit via an electrically isolated control path provides control and communication between the electronic sensing, control and protection circuit and the semiconductor switch. ## Claims ### Claim 1 A disconnect device, comprising: a mounting plate or a circuit board having: a semiconductor switch supported on the mounting plate connecting or disconnecting an input power source to or from a load; and an electronic sensing, control and protection circuit supported on the mounting plate and connected to the semiconductor switch to control operation of the semiconductor switch; and a control unit in communication with the electronic sensing, control and protection circuit via an electrically isolated control path to provide control and communication between the electronic sensing, control and protection circuit and the semiconductor switch. ### Claim 2 (depends on 1) The disconnect device of claim 1, wherein the semiconductor switch includes a plurality of semiconductor dies using a semiconductor material including silicon, silicon carbide, gallium oxide, and gallium nitride to form a MOSFET, an IGBT or a JFET, the disconnect device blocking high voltage in a single direction or both directions during an off-state. ### Claim 3 (depends on 1) The disconnect device of claim 1, wherein the electronic sensing, control and protection circuit generates an active control of the semiconductor switch, and wherein the active control defines a commanded active disconnect open under non-electrical fault conditions. ### Claim 4 (depends on 1) The disconnect device of claim 1, wherein the electronic sensing, control and protection circuit defines a passive control of the semiconductor switch. ### Claim 5 (depends on 1) The disconnect device of claim 1, wherein the semiconductor switch, the electronic sensing, control and protection circuit and the control unit include no moving parts. ### Claim 6 (depends on 1) The disconnect device of claim 1, further including an electrically non-conductive covering provided on the disconnect device, the covering defining a polymeric material. ### Claim 7 (depends on 1) The disconnect device of claim 1, further including an electrically isolated thermally conductive substrate applied to the mounting plate, having the semiconductor switch and the semiconductor switch mounted to the substrate. ### Claim 8 (depends on 1) The disconnect device of claim 1, further including a programmable trip current vs time applied by the control unit to command disconnect of the load from the input power source. ### Claim 9 (depends on 1) The disconnect device of claim 1, wherein the semiconductor switch is operable to open in 0.2 ms or less upon receipt of an open command. ### Claim 10 (depends on 1) The disconnect device of claim 1, further including a disconnect device status wherein the disconnect device continuously or at a predetermined time interval communicates the disconnect device status to the control unit via the control path. ### Claim 11 A disconnect device for an automobile vehicle, comprising: a mounting plate having: a thermally conductive and electrically insulated substrate applied onto the mounting plate; a first layer of an electrically conductive material applied onto the substrate; a semiconductor switch supported on the first layer connecting or disconnecting an input power source to or from a load; a second layer of an electrically conductive material applied onto the substrate electrically isolated from the first layer; and an electronic sensing, control and protection circuit supported on the second layer and connected to the semiconductor switch to control operation of the semiconductor switch; and a control unit in communication with the electronic sensing, control and protection circuit via an electrically isolated control path to provide control and communication between the electronic sensing, control and protection circuit and the semiconductor switch. ### Claim 12 (depends on 11) The disconnect device for the automobile vehicle of claim 11, further including a switch driver and a controller connected to the second layer in communication with the semiconductor switch, wherein the switch driver and the controller provide built-in sensing and protection against overvoltage and thermal overload during repeated reconnection and disconnection of the load when faulted. ### Claim 13 (depends on 12) The disconnect device for the automobile vehicle of claim 12, wherein the controller includes at least one of: a trip-current vs time set point disconnecting the load from the input power source when the set point is reached; a trip-current and voltage vs time set point disconnecting the load from the input power source when the set point is reached; and a trip-current and temperature vs time set point disconnecting the load from the input power source when the set point is reached. ### Claim 14 (depends on 12) The disconnect device for the automobile vehicle of claim 12, further including a printed circuit board and a signal connector connected to the second layer, the printed circuit board providing communication between the semiconductor switch and the switch driver and the controller and the signal connector. ### Claim 15 (depends on 14) The disconnect device for the automobile vehicle of claim 14, wherein the signal connector is in communication with the control unit, the control unit generating voltage bias power and control signals for operation of the power switch. ### Claim 16 (depends on 11) The disconnect device for the automobile vehicle of claim 11, wherein the semiconductor switch includes a plurality of semiconductor dies using a semiconductor material including at least one of silicon, silicon carbide, gallium oxide, and gallium nitride to form a MOSFET, an IGBT or a JFET, the disconnect device blocking high voltage in a single direction or both directions during an off-state. ### Claim 17 (depends on 11) The disconnect device for the automobile vehicle of claim 11, further including: a first conductive bus bar connected to the first layer and providing a connection to the input power source; and a second conductive bus bar connected to the second layer and to the load. ### Claim 18 A method for operating a disconnect device, comprising: installing a thermally conductive substrate onto a mounting plate; attaching a first layer of an electrically conductive material onto the substrate; supporting a semiconductor switch on the first layer acting to connect or disconnect an input power source to or from a load; electrically isolating a second layer of an electrically conductive material on the substrate from the first layer; connecting an electronic sensing, control and protection circuit to the second layer and to the semiconductor switch to control operation of the semiconductor switch; and providing a control unit in communication with the electronic sensing, control and protection circuit via an electrically isolated control path to provide control and communication between the electronic sensing, control and protection circuit and the semiconductor switch. ### Claim 19 (depends on 18) The method of claim 18, further including generating voltage bias power and control signals by the control unit for operation of the semiconductor switch. ### Claim 20 (depends on 19) The method of claim 19, further including opening the semiconductor switch to disconnect the load from the input power source when a load current exceeds a predetermined value with respect to time under overload or short-circuit conditions.