# US 2021/0344100 A1 · Waveguide antenna with integrated temperature management > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2021/0344100 A1 - Document ID: US20210344100A1 - Status: Published application - Kind: A1 - Application number: 17/375,145 - Filed: 2021-07-14 - Published: 2021-11-04 - Earliest claimed: 2020-01-07 - Assignees: Aptiv Technologies AG - Applicants: Aptiv Technologies Limited - Inventors: Scott D. Brandenburg; David W. Zimmerman; Shawn Shi - Web page: https://patentgrep.com/patent/US20210344100A1 ## CPC - H01Q 1/02: Arrangements for de-icing; Arrangements for drying-out {; Arrangements for cooling; Arrangements for preventing corrosion} - H01Q 1/2283: {mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package} - H01Q 1/22: by structural association with other equipment or articles - H01Q 13/00: Waveguide horns or mouths; Slot antennas; Leaky-waveguide antennas; Equivalent structures causing radiation along the transmission path of a guided wave - H05K 1/0243: {Printed circuits associated with mounted high frequency components} - H05K 3/4614: {the electrical connections between the circuit boards being made during lamination} - H05K 7/2029: {using a liquid coolant with phase change in electronic enclosures (in cabinets of standardized dimensions H05K7/20536; in server cabinets H05K7/20709; in vehicle electronic casings H05K7/20845; in power control electronics H05K7/2089; in displays H05K7/20954)} - H01Q 1/3233: {particular used as part of a sensor or in a security system, e.g. for automotive radar, navigation systems} - H01Q 13/06: Waveguide mouths (horns H01Q13/02) - H01Q 21/064: {using horn or slot aerials (slotted waveguides arrays H01Q21/005)} - H05K 2201/10098: Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas - H05K 2201/10166: Transistor - H01Q: ANTENNAS, i.e. RADIO AERIALS (radiators or antennas for microwave heating H05B6/72) - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract An illustrative example embodiment of an antenna device includes a substrate, a plurality of antenna elements supported on the substrate, an integrated circuit supported on one side of the substrate, and a metallic waveguide antenna situated against the substrate. The metallic waveguide antenna includes a heat dissipation portion in a thermally conductive relationship with the integrated circuit. The heat dissipation portion is configured to reduce a temperature of the integrated circuit. ## Claims ### Claim 1 An antenna, comprising: at least one antenna element; an integrated circuit operatively associated with the at least one antenna element; and a waveguide situated near the at least one antenna element, the waveguide including at least one passage through which radiation may pass toward or away from the at least one antenna element, the waveguide having a heat dissipation portion at least partially within the waveguide, the heat dissipation portion being in a thermally conductive relationship with the integrated circuit and configured to reduce a temperature of the integrated circuit. ### Claim 2 (depends on 1) The antenna of claim 1, wherein the heat dissipation portion comprises a heat exchanger including a plurality of metallic members arranged to allow fluid flow between the metallic members. ### Claim 3 (depends on 2) The antenna of claim 2, wherein the metallic members comprise fins. ### Claim 4 (depends on 1) The antenna of claim 1, wherein the heat dissipation portion comprises a chamber configured to contain a fluid for absorbing heat from the integrated circuit. ### Claim 5 (depends on 4) The antenna of claim 4, wherein the chamber defines a first volume within the chamber; the fluid is a liquid; and the liquid has a second volume that is less than the first volume. ### Claim 6 (depends on 5) The antenna of claim 5, wherein the second volume is between 10% and 60% of the first volume. ### Claim 7 (depends on 6) The antenna of claim 6, wherein the second volume is 30% of the first volume. ### Claim 8 (depends on 5) The antenna of claim 5, wherein the liquid is at least one of water, ethylene glycol and acetone. ### Claim 9 (depends on 5) The antenna of claim 5, comprising a wicking structure situated in the chamber, the wicking structure being configured to facilitate circulation of a vaporized portion of the liquid back into the liquid. ### Claim 10 (depends on 9) The antenna of claim 9, wherein the waveguide comprises copper; the wicking structure comprises a sinter paste or a copper etching; and the sinter paste or the copper etching is situated on a surface within the chamber that is closer to the integrated circuit than the liquid. ### Claim 11 (depends on 1) The antenna of claim 1, wherein the waveguide includes a cavity configured to receive the integrated circuit; and the cavity provides electromagnetic shielding around the integrated circuit. ### Claim 12 (depends on 1) The antenna of claim 1, wherein the waveguide comprises a plurality of layers of metallic material secured together; and at least one of the layers includes the heat dissipation portion. ### Claim 13 (depends on 12) The antenna of claim 12, wherein the heat dissipation portion comprises a chamber; the at least one of the layers defines at least two interior surfaces of the chamber; and at least one other of the layers defines at least one interior surface of the chamber. ### Claim 14 (depends on 1) The antenna of claim 1, wherein the at least one antenna element comprises a plurality of antenna elements; the at least one passage comprises a plurality of passages; and each of the passages is aligned with one of the antenna elements. ### Claim 15 (depends on 14) The antenna of claim 14, wherein the waveguide comprises a thermally conductive material; and the heat dissipation portion is situated between two of the passages such that at least some heat dissipated by the heat dissipation portion escapes through the two of the passages.