Process for separating a plate into individual components
AssigneeOmmic
InventorPeter Michael FRIJLINK
Life of this patent
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Abstract
Disclosed is a method for separating a plate into multiple individual detached components or cutting the plate into chips. The back end process for a plate includes providing a substrate; attaching the plate to the substrate using a sacrificial layer that is made of materials that in a solid state at ambient temperature and ambient pressure, and having a transformation temperature into one or more gaseous compounds at ambient pressure of between 80° C. and 600° C.; and separating the plate attached on the substrate into a plurality of plate portions; increasing temperature and/or reducing surrounding pressure to transform the sacrificial layer into one or more gaseous compounds.
Claims20
Process for back end processing of a plate in order to obtain a plurality of individual detached electrical, optical or optoelectronic components, comprising:
- a) providing a substrate,
- b) attaching the plate to the substrate by means of a sacrificial layer between this plate and this substrate, the sacrificial layer being in contact with the plate and with the substrate, the sacrificial layer being made from at least one material that is in a solid state at ambient temperature and ambient pressure, the sacrificial layer having a transformation temperature into one or more gaseous compounds at ambient pressure of between 80° C. and 600° C.,
- c) separating the plate attached on the substrate into a plurality of plate portions attached on the substrate, the substrate remaining as a single piece, and
- d) increasing the temperature and/or reducing the surrounding pressure to a sufficiently high temperature and/or a sufficiently low pressure, respectively, in order to transform the sacrificial layer attached to the plurality of plate portions into one or more gaseous compounds.
Dependencies are inferred from the claim text.