# US 2021/0340672 A1 · Plasma Assisted Parylene Deposition

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- Number: US 2021/0340672 A1
- Document ID: US20210340672A1
- Status: Published application
- Kind: A1
- Application number: 16/863,659
- Filed: 2020-04-30
- Published: 2021-11-04
- Earliest claimed: 2020-04-30
- Applicants: HZO, Inc.
- Inventors: Robert Eugene Askin, III; Sean Owen Clancy
- Web page: https://patentgrep.com/patent/US20210340672A1

## CPC

- C23C 16/4485: {by evaporation without using carrier gas in contact with the source material (C23C16/4486 takes precedence)}
- B05D 1/60: {Deposition of organic layers from vapour phase (vapour phase deposition in general C23C14/00, C23C16/00)}
- B05D 1/62: {Plasma-deposition of organic layers (plasma deposition in general C23C14/00, C23C16/00)}
- C08G 61/025: {Polyxylylenes}
- C09D 165/00: Coating compositions based on macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain (C09D107/00 - C09D157/00, C09D161/00 take precedence); Coating compositions based on derivatives of such polymers
- C23C 14/12: Organic material
- C23C 16/452: by activating reactive gas streams before {their} introduction into the reaction chamber, e.g. by {ionisation} or addition of reactive species
- C23C 16/52: Controlling or regulating the coating process {(C23C16/45557, C23C16/279 take precedence)}
- H01J 37/32082: {Radio frequency generated discharge (H01J37/32357, H01J37/32366, H01J37/32394 and H01J37/32403 take precedence)}
- H01J 37/32357: {Generation remote from the workpiece, e.g. down-stream}
- H01J 37/3244: {Gas supply means}
- B05D 3/141: {Plasma treatment}
- C08G 2261/11: Homopolymers
- C08G 2261/312: Non-condensed aromatic systems, e.g. benzene
- C08G 2261/3326: alkane-based
- C08G 2261/40: Polymerisation processes
- C23C: COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion B21C23/22; covering with metal by connecting pre-existing layers to articles, see the relevant places, e.g. B21D39/00, B23K; metallising of glass C03C; metallising mortars, concrete, artificial stone, ceramics or natural stone C04B41/00; enamelling of, or applying a vitreous layer to, metals C23D; treating metal surfaces or coating of metals by electrolysis or electrophoresis C25D; single-crystal film growth C30B; by metallising textiles D06M11/83; decorating textiles by locally metallising D06Q1/04)
- B05D: PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL (conveying articles or workpieces through baths of liquid B65G, e.g. B65G49/02)
- C08G: MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C09D: COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR (cosmetics A61K; processes for applying liquids or other fluent materials to surfaces, in general, B05D; staining wood B27K5/02; glazes or vitreous enamels C03C; natural resins, French polish, drying-oils, driers, turpentine, per se, C09F; polishing compositions other than French polish, ski waxes C09G; adhesives or use of materials as adhesives C09J; materials for sealing or packing joints or covers C09K3/10; materials for stopping leaks C09K3/12; processes for the electrolytic or electrophoretic production of coatings C25D)
- H01J: ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS (spark-gaps H01T; electric arc lamps H05B31/00; particle accelerators H05H)

## Abstract

A method for depositing parylene onto a substrate includes utilizing a vaporization chamber and a pyrolysis chamber to crack a dimer into a monomer gas, directly ionizing the monomer gas by passing the monomer gas through a plasma generation chamber comprising plasma prior to injection of the monomer gas into a deposition chamber, and polymerizing the ionized monomer in the deposition chamber to create a polymer and a protective coating on a substrate.

## Claims

### Claim 1

A method for depositing parylene onto a substrate, comprising:
utilizing a vaporization chamber and a pyrolysis chamber to crack a dimer into a monomer gas;
directly ionizing the monomer gas by passing the monomer gas through a plasma generation chamber comprising plasma prior to injection of the monomer gas into a deposition chamber;
polymerizing the ionized monomer in the deposition chamber to create a polymer and a protective coating on a substrate.

### Claim 2 (depends on 1)

The method of claim 1, further comprising modifying radicals of the monomer gas with the plasma, wherein the modification increases the reactivity of the radicals.

### Claim 3 (depends on 1)

The method of claim 1, wherein the monomer gas is ionized between the pyrolysis chamber and the deposition chamber.

### Claim 4 (depends on 1)

The method of claim 1, wherein the plasma is generated by a plasma generation system, where the plasma generation system is a radio frequency plasma generation system.

### Claim 5 (depends on 1)

The method of claim 1, wherein the plasma is generated by a plasma generation system, where the plasma generation system is a pulsed direct current plasma generation system.

### Claim 6 (depends on 1)

The method of claim 1, wherein the polymer on the substrate is a parylene N coating.

### Claim 7 (depends on 1)

The method of claim 1, wherein the polymer on the substrate is a parylene F coating.

### Claim 8 (depends on 8)

The method of claim 8, wherein the monomer is a parylene monomer.

### Claim 9

A method for depositing parylene onto a substrate, comprising:
injecting a monomer gas into a deposition chamber;
injecting a plasma into the deposition chamber, the plasma generated in a plasma generation chamber;
ionizing the monomer gas with the plasma to generate ionized monomer; and
polymerizing the ionized monomer to create a polymer and a protective coating on a substrate.

### Claim 10 (depends on 9)

The method of claim 9, further comprising modifying radicals of the monomer gas with the plasma, wherein the modification increases the reactivity of the radicals.

### Claim 11 (depends on 9)

The method of claim 9, wherein the plasma is generated by a plasma generation system, where the plasma generation system is a radio frequency plasma generation system.

### Claim 12 (depends on 9)

The method of claim 9, wherein the plasma is generated by a plasma generation system, where the plasma generation system is a pulsed direct current plasma generation system.

### Claim 13 (depends on 9)

The method of claim 9, wherein the polymer on the substrate is a parylene N or parylene F coating.

### Claim 14 (depends on 9)

The method of claim 9, further comprising energizing the monomer gas after cracking dimer.

### Claim 15 (depends on 9)

The method of claim 9, further comprising utilizing a vaporization chamber and a pyrolysis chamber to crack a dimer into a monomer gas, and wherein the monomer is a parylene monomer.

### Claim 16

A system comprising:
a pyrolysis chamber configured to crack a dimer into a monomer gas;
a plasma generation system configured to generate a plasma;
a deposition chamber configured to facilitate polymerization of an ionized monomer gas into a polymer and a protective coating on a substrate.

### Claim 17 (depends on 16)

The system of claim 16, wherein the plasma generation system is coupled to a plasma generation chamber, wherein the plasm generation chamber is positioned between the pyrolysis chamber and the deposition chamber.

### Claim 18 (depends on 16)

The system of claim 16, wherein the plasma generation system is a radio frequency plasma generation system.

### Claim 19 (depends on 16)

The system of claim 16, wherein the plasma generation system is a pulsed direct current plasma generation system.

### Claim 20 (depends on 16)

The system of claim 16, wherein the plasma generation system is coupled to deposition chamber, wherein the plasma generation system is configured to inject plasma into the deposition chamber.