# US 2021/0340665 A1 · Deposition mask and method of manufacturing deposition mask

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- Number: US 2021/0340665 A1
- Document ID: US20210340665A1
- Status: Published application
- Kind: A1
- Application number: 17/305,731
- Filed: 2021-07-14
- Published: 2021-11-04
- Earliest claimed: 2017-01-17
- Assignees: Dai Nippon Printing Co., Ltd.
- Applicants: Dai Nippon Printing Co., Ltd.
- Inventors: Yasuhiro UCHIDA; Sachiyo MATSUURA; Chikao IKENAGA
- Web page: https://patentgrep.com/patent/US20210340665A1

## CPC

- C23F 1/02: Local etching
- C23C 14/042: {using masks}
- H10K 71/166: {using selective deposition, e.g. using a mask}
- B05C 21/005: {Masking devices (stencils B05C17/06; masking devices for which the means for applying liquids or other fluent material is spraying or is not important B05B12/20)}
- G03F 7/0015: {Production of aperture devices, microporous systems or stamps}
- H10K 71/40: Thermal treatment, e.g. annealing in the presence of a solvent vapour
- C23F: NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE (working metal by laser beams B23K26/00; desurfacing by applying flames B23K7/00; working of metal by electro-erosion B23H; producing decorative effects by removing surface material, e.g. by engraving, by etching, B44C1/22; electrolytic etching or polishing C25F); INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23C: COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion B21C23/22; covering with metal by connecting pre-existing layers to articles, see the relevant places, e.g. B21D39/00, B23K; metallising of glass C03C; metallising mortars, concrete, artificial stone, ceramics or natural stone C04B41/00; enamelling of, or applying a vitreous layer to, metals C23D; treating metal surfaces or coating of metals by electrolysis or electrophoresis C25D; single-crystal film growth C30B; by metallising textiles D06M11/83; decorating textiles by locally metallising D06Q1/04)
- H10K: ORGANIC ELECTRIC SOLID-STATE DEVICES
- B05C: APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL (spraying apparatus, atomising apparatus, nozzles B05B; plant for applying liquids or other fluent materials to objects by electrostatic spraying B05B5/08)
- G03F: PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR; (phototypographic composing devices B41B; photosensitive materials or processes for photographic purposes G03C; electrophotography, sensitive layers or processes therefor G03G)

## Abstract

A deposition mask includes: a first surface and a second surface, in which a plurality of through-holes are formed; a pair of long side surfaces connected to the first and second surfaces, and defining a profile of the deposition mask in a longitudinal direction of the deposition mask; and a pair of short side surfaces connected to the first and second surfaces, and defining a profile of the deposition mask in a width direction of the deposition mask. The long side surface includes a first portion that is recessed inside and includes a first end portion positioned along the first surface, and a second end portion positioned along the second surface and positioned inside the first end portion. The through-hole includes a first recess formed on the first surface, and a second recess formed on the second surface and connected to the first recess through a hole connection portion.

## Claims

### Claim 1

A deposition mask in which a plurality of through-holes are formed, comprising:
a first surface and a second surface, in which the plurality of through-holes are formed;
a pair of long side surfaces connected to the first surface and the second surface, and defining a profile of the deposition mask in a longitudinal direction of the deposition mask; and
a pair of short side surfaces connected to the first surface and the second surface, and defining a profile of the deposition mask in a width direction of the deposition mask;
wherein the through-hole includes a first recess formed the first surface, and a second recess formed the second surface and connected to the first recess through a hole connection portion;
wherein the first recess includes a wall surface extending from the hole connection portion to the first surface, the second recess includes a wall surface extending from the hole connection portion to the second surface, a height of the wall surface of the first recess is smaller than the height of the wall surface of the second recess, and the height of the wall surface of the first recess is equal to or less than 6 μm,
wherein each of the long side surfaces includes a first portion that is recessed inside, the first position including a first end portion positioned along the first surface, and a second end portion positioned along the second surface and positioned inside the first end portion; and
wherein the first end portion corresponds to a first connection portion to which the first surface and the long side surface are connected, the first connection portion being positioned at a same plane with the first surface.

### Claim 2 (depends on 1)

The deposition mask according to claim 1, wherein the first portion is positioned inside a virtual plane or line, the virtual plane or line passing the first end portion and the second end portion.

### Claim 3 (depends on 1)

The deposition mask according to claim 1, wherein a thickness of the deposition mask is equal to or less than 50 μm.

### Claim 4 (depends on 1)

The deposition mask according to claim 1, wherein the second end portion corresponds to a second connection portion to which the second surface and the long side surface are connected, the second connection portion being positioned at a same plane with the second surface.

### Claim 5

A manufacturing method of a deposition mask in which a plurality of through-holes are formed, comprising:
a step of preparing a metal plate including a first surface and a second surface opposite to the first surface; and
a processing step of processing the metal plate to obtain the deposition mask which includes a first surface and a second surface in which the plurality of through-holes are formed, a pair of long side surfaces connected to the first surface and the second surface, and defining a profile of the deposition mask in a longitudinal direction of the deposition mask, and a pair of short side surfaces connected to the first surface and the second surface, and defining a profile of the deposition mask in a width direction of the deposition mask;
wherein the through-hole includes a first recess formed the first surface, and a second recess formed the second surface and connected to the first recess through a hole connection portion;
wherein the first recess includes a wall surface extending from the hole connection portion to the first surface, the second recess includes a wall surface extending from the hole connection portion to the second surface, a height of the wall surface of the first recess is smaller than the height of the wall surface of the second recess, and the height of the wall surface of the first recess is equal to or less than 6 μm,
wherein each of the long side surfaces includes a first portion that is recessed inside, the first portion including a first end portion positioned along the first surface, and a second end portion positioned along the second surface and positioned inside the first end portion;
wherein the through-hole includes a first recess formed on the first surface, and a second recess formed on the second surface and connected to the first recess through a hole connection portion; and
wherein the first end portion of the first portion of the long side surface is positioned closer to the first surface than the hole connection portion.

### Claim 6 (depends on 5)

The manufacturing method according to claim 5, wherein the processing step includes a second-surface etching step of etching the metal plate along the second surface so as to form the first portion of the long side surface; and
wherein the second-surface etching step is performed such that the first end portion of the first portion corresponds to a first connection portion to which the first surface and the long side surface are connected, the first connection portion being positioned at a same plane with the first surface.

### Claim 7 (depends on 5)

The manufacturing method according to claim 5, the processing step including:
a first-surface etching step of etching the metal plate along the first surface so as to form a second portion of the long side surface; and
a second-surface etching step of etching the metal plate along the second surface so as to form the first portion of the long side surface,
the second portion being positioned between the first end portion of the first portion of the long side surface and the first surface of the metal plate.

### Claim 8 (depends on 5)

The manufacturing method according to claim 5, wherein a distance between a first connection portion and the first end portion of the first portion of the long side surface in a plane direction of the first surface is equal to or less than 3.5 μm, the first connection portion being positioned at a same plane with the first surface and connecting the first surface and the long side surface.

### Claim 9

A manufacturing method of a deposition mask in which a plurality of through-holes are formed, comprising:
a step of preparing a metal plate including a first surface and a second surface opposite to the first surface; and
a processing step of processing the metal plate to obtain the deposition mask which includes a first surface and a second surface in which the plurality of through-holes are formed, a pair of long side surfaces connected to the first surface and the second surface, and defining a profile of the deposition mask in a longitudinal direction of the deposition mask, and a pair of short side surfaces connected to the first surface and the second surface, and defining a profile of the deposition mask in a width direction of the deposition mask;
wherein the through-hole includes a first recess formed the first surface, and a second recess formed the second surface and connected to the first recess through a hole connection portion;
wherein the first recess includes a wall surface extending from the hole connection portion to the first surface, the second recess includes a wall surface extending from the hole connection portion to the second surface, a height of the wall surface of the first recess is smaller than the height of the wall surface of the second recess, and the height of the wall surface of the first recess is equal to or less than 6 μm,
wherein each of the long side surfaces includes a first portion that is recessed inside, the first portion including a first end portion positioned along the first surface, and a second end portion positioned along the second surface and positioned inside the first end portion;
wherein the processing step includes a second-surface etching step of etching the metal plate along the second surface so as to form the first portion of the long side surface; and
wherein the second-surface etching step is performed such that the first end portion of the first portion corresponds to a first connection portion to which the first surface and the long side surface are connected, the first connection portion being positioned at a same plane with the first surface.