# US 2021/0333322 A1 · Wafer probe station

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- Number: US 2021/0333322 A1
- Document ID: US20210333322A1
- Status: Published application
- Kind: A1
- Application number: 16/854,926
- Filed: 2020-04-22
- Published: 2021-10-28
- Earliest claimed: 2020-04-22
- Assignees: Mpi Corporation
- Applicants: MPI Corporation
- Inventors: Stojan KANEV; Chia-Hung HUNG
- Web page: https://patentgrep.com/patent/US20210333322A1

## CPC

- G01R 31/2891: {related to sensing or controlling of force, position, temperature (G01R31/2874 takes precedence; sensing of force G01L; sensing of position G01B, G01D; sensing of temperature G01K; controlling in general G05)}
- G01R 31/2887: {involving moving the probe head or the IC under test; docking stations (moving single probes G01R1/06705; moving individual probes in multiple probes G01R1/07392)}
- G01R 31/2865: {Holding devices, e.g. chucks; Handlers or transport devices (having contacts G01R31/2863)}
- G01R 31/2875: {related to heating}
- G01R: MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES (indicating correct tuning of resonant circuits H03J3/12)

## Abstract

A wafer probe station includes a thermal chuck, a chuck stage, a platen, some probes, a first focusing device, a second focusing device and a thermal plate. The thermal chuck heats up to an operational temperature and holds a device under test (DUT). The chuck stage connects with the thermal chuck and moves the thermal chuck. The thermal chuck locates between the chuck stage and the platen. The probes are disposed on the platen and configured to contact with the DUT. The first focusing device is disposed on the platen to focus on the DUT. The second focusing device is disposed on the chuck stage to focus on the probes. The thermal plate locates between the second focusing device and the platen and is configured to heat up to the operational temperature. The thermal plate has a through hole aligning with the second focusing device.

## Claims

### Claim 1

A wafer probe station, comprising:
a thermal chuck configured to heat up to an operational temperature and to hold a device under test;
a chuck stage connected with the thermal chuck and configured to move the thermal chuck;
a platen, the thermal chuck being located between the chuck stage and the platen;
a plurality of probes disposed on the platen and configured to contact with the device under test;
a first focusing device disposed on the platen and configured to focus on the device under test;
a second focusing device disposed on the chuck stage and configured to focus on at least one of the probes; and
a thermal plate located between the second focusing device and the platen and configured to heat up to the operational temperature, the thermal plate having a through hole aligning with the second focusing device.

### Claim 2 (depends on 1)

The wafer probe station of claim 1, wherein the first focusing device comprises a mirror and a platen optic, the platen optic is movable relative to the mirror along an extension direction of the platen, the mirror is configured to reflect an image of the device under test to the platen optic, the platen optic is configured to focus the image.

### Claim 3 (depends on 2)

The wafer probe station of claim 2, wherein the mirror inclines by 45 degrees relative to the extension direction.

### Claim 4 (depends on 1)

The wafer probe station of claim 1, wherein the second focusing device is configured to focus on a tip of at least one of the probes.

### Claim 5 (depends on 1)

The wafer probe station of claim 1, wherein the thermal plate is connected with thermal chuck.

### Claim 6 (depends on 1)

The wafer probe station of claim 1, wherein the thermal plate is connected with a heat controlling source.

### Claim 7 (depends on 1)

The wafer probe station of claim 1, wherein the thermal plate is a metal.

### Claim 8 (depends on 1)

The wafer probe station of claim 1, wherein the thermal plate is a glass.

### Claim 9 (depends on 1)

The wafer probe station of claim 1, wherein the chuck stage is configured to move the thermal chuck three-dimensionally and rotatably.

### Claim 10 (depends on 1)

The wafer probe station of claim 1, further comprising a light source disposed at a side of the second focusing device near to the platen.

### Claim 11 (depends on 10)

The wafer probe station of claim 10, wherein the light source is of an annular shape.