Conductive Circuit-Attached Molded Product and Manufacturing Method for the Same, and Conductive Circuit-Attached Preform and Manufacturing Method for the Same

Abstract

A manufacturing method is configured to include arranging a conductive circuit-attached film, in which a conductive circuit having stretchability is formed on a base film, on a molding surface of a first mold having the molding surface for forming an internal surface of a preform; mold-clamping the first mold and a second mold paired with the first mold; molding the preform by injecting molten resin into a cavity formed by the mold-clamping; mold-opening the first mold and the second mold; taking out a conductive circuit-attached preform in which the conductive circuit-attached film and the preform are integrated; and blow-molding the conductive circuit-attached preform.

Dependencies are inferred from the claim text.