Sputtering apparatus
AssigneeTokyo Electron Limited
InventorManabu NAKAGAWASAI
Life of this patent
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Abstract
A sputtering apparatus includes a base on which a substrate is mounted, an annular member disposed at an outer periphery of the base to surround a side surface and a backside of the substrate without in contact with the substrate, and an edge cover that covers an outer edge of an upper surface of the substrate mounted on the base. The annular member has a first surface facing the backside of the substrate mounted on the base with a gap, a second surface facing the side surface of the substrate mounted on the base with a gap, and a tapered surface formed at a corner portion between the first surface and the second surface.
Claims13
A sputtering apparatus comprising:
- a base on which a substrate is placed;
- an annular member disposed at an outer periphery of the base to surround a side surface and a backside of the substrate without in contact with the substrate;
- and
- an edge cover that covers an outer edge of an upper surface of the substrate placed on the base,
- wherein the annular member has:
- a first surface facing the backside of the substrate placed on the base with a gap,
- a second surface facing the side surface of the substrate placed on the base with a gap, and
- a tapered surface formed at a corner portion between the first surface and the second surface.
Dependencies are inferred from the claim text.