Method for adhering profiles to substrate surfaces

Abstract

Provided are methods for adhesively bonding profiles to substrate surface. An example method includes plasma-treating each of a profile surface and a first adhesive side of a layer of pressure sensitive adhesive. The pressure sensitive adhesive includes a) 40 to 70 wt %, based on the total weight of the pressure sensitive adhesive, of at least one poly(meth)acrylate; b) 15 to 50 wt %, based on the total weight of the pressure sensitive adhesive, of at least one synthetic rubber; and c) at least one tackifier compatible with the poly(meth)acrylate(s). The method further includes bonding the profile surface and the first adhesive side to one another, plasma-treating a second adhesive side of the layer of the pressure sensitive adhesive, and bonding the plasma-treated second adhesive side to the substrate surface.

Dependencies are inferred from the claim text.