Cooling mechanism for electrionic component mounted on a printed wiring board
AssigneeHamilton Sundstrand Corporation
InventorHebri Vijayendra Nayak
Life of this patent
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Abstract
An electronic component module assembly includes a printed wiring board, and a stiffener assembly affixed to a first side of the printed wiring board. The stiffener assembly includes an outer stiffener secured to the printed wiring board, an inner stiffener removably located in an opening of the outer stiffener. The inner stiffener has one or more inner stiffener pockets formed therein, and one or more electronic components are installed in one or more inner stiffener pockets, and electrically connected to the printed wiring board.
Claims20
An electronic component module assembly, comprising:
- a printed wiring board;
- and
- a stiffener assembly affixed to a first side of the printed wiring board, the stiffener assembly including:
- an outer stiffener secured to the printed wiring board;
- an inner stiffener removably disposed in an opening of the outer stiffener, the inner stiffener having one or more inner stiffener pockets formed therein;
- and
- one or more electronic components installed in one or more inner stiffener pockets, and electrically connected to the printed wiring board.
A method of assembly of an electronic component module assembly, comprising:
- installing one or more electronic components at a first inner stiffener side of an inner stiffener;
- installing the inner stiffener into an opening defined in an outer stiffener, the inner stiffener installed to a first outer stiffener side of the outer stiffener;
- and
- securing a printed wiring board to a second outer stiffener side of the outer stiffener opposite the first outer stiffener side, the securing bringing the one or more electronic components into electrical contact with the printed wiring board.
Dependencies are inferred from the claim text.