Electronic device case and manufacturing method therefor
AssigneeSamsung Electronics Co., Ltd.
InventorHyunsoo KIM
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Abstract
Various embodiments relate to a case included in an electronic device, and according to one embodiment, an electronic device case comprises: an exterior case formed by processing an upper surface of a base material of the electronic device case by means of a first head of a CNC device, and at least one pattern formed by processing a lateral surface of the exterior case by means of second and third heads of the CNC device, wherein at least one pattern includes first and second patterns, the first pattern is processed at the lateral surface of the exterior case by means of the second head, and the second pattern can be processed at the first pattern by means of the third head. In addition, other various embodiments are possible.
Claims15
A case of an electronic device comprising:
- an external case formed by processing an upper surface of a base of the case of the electronic device with a first head of a CNC device;
- and
- at least one pattern formed by processing a side surface of the external case with a second head and a third head of the CNC device,
- wherein the at least one pattern comprises a first pattern and a second pattern, and
- wherein the first pattern is formed by processing on the side surface of the external case with the second head, and the second pattern is formed by processing on the first pattern with the third head.
Dependencies are inferred from the claim text.