Three-dimensional printing
AssigneeHewlett-Packard Development Company, L.P.
InventorsSterling Chaffins, Kevin P. Dekam, Thomas A. Saksa, Juan Sebastian Ramirez
Life of this patent
Estimating the term…
Abstract
According to examples, a method of making a three-dimensional conductive printed part, including forming a layer of polymeric build material; selectively applying a fusing agent on a first selected area of the formed polymeric build material; selectively applying a conductive agent on a second selected area of the formed polymeric build material; and applying a solder receiving material to a portion of the first selected area and a portion of the second selected area; in which the solder receiving material is present on a surface of the conductive three-dimensional printed part is disclosed.
Claims15
A method of making a three-dimensional conductive printed part, comprising:
- forming a layer of polymeric build material;
- selectively applying a fusing agent on a first selected area of the formed polymeric build material;
- selectively applying a conductive agent on a second selected area of the formed polymeric build material;
- and
- applying a solder receiving material to a portion of the first selected area and a portion of the second selected area;
- wherein the solder receiving material is present on a surface of the conductive three-dimensional printed part.
The method of claim 2, wherein applying a solder receiving material includes a process selected from the group consisting of electrolysis, electroless, thin-film deposition, vapor deposition, thin-film deposition, and sputtering.
The method of claim 3, wherein the process is an electroless plating process with a copper compound as the solder receiving material.
The method of claim 4, wherein the electroless plating process occurs at room temperature for a period of about 5 minutes to about 120 minutes.
A conductive three-dimensional printed part comprising:
- a first selected area including a fused polymeric composite of a polymeric build material fused with a fusing agent;
- a second selected area including a conductive polymeric composite of the polymeric build material sintered with a conductive agent;
- and
- a solder receiving material applied on a portion of the first selected area and a portion of the second selected area;
- wherein the solder receiving material is present on a surface of the conductive three-dimensional printed part.
An electronic device, comprising:
- a solder receiving material applied on a portion of a first selected area including a fused polymeric composite of a polymeric build material and a fusing agent, and on a portion of a second selected area including a conductive polymeric composite of the polymeric build material and a conductive agent;
- and
- an electrical component applied on the solder receiving material.
Dependencies are inferred from the claim text.