Advanced Manufacturing Method for the Manufacturing of High-Precision Electronic Flexible Circuit Boards enabling the Democratization of design, development, and production of electronic and electrical devices

A method of preparing copper sheeting for exposure to UV or optical light in the process of manufacturing flexible printed circuit boards comprising:

• laminating the copper sheeting with a photoresist material;
• applying a sticker onto a surface of the photoresist material of the laminated copper sheeting, wherein the sticker has a sticky side and a smooth side and is made of a transparent or translucent material, wherein the sticky side of the sticker is placed completely flush to the surface of the photoresist material of the laminated copper sheeting in order to minimize gaps between the sticker and the surface of the photoresist material of the laminated copper sheeting, and wherein the sticky side of the sticker is coated with an optically reflective glue in order to reflect incidental UV light and other light away from the gaps between the sticker and the surface of the photoresist material of the laminated copper sheeting;
• laser printing, using black ink, a circuit design onto the smooth side of the sticker;
• hot-laminating toner-adhering decorative foil onto the smooth, black ink covered side of the sticker;
• and
• gently scrubbing the surface of the toner-adhering decorative foil with a cleaning agent, wherein the cleaning agent removes the toner-adhering decorative foil over surfaces of the sticker that are not covered in the black ink.