Method of cutting electronic component, method of removing component, and method of manufacturing electronic device
AssigneeKioxia Corporation
InventorsKazuya NAGASAWA, Norihiro ISHII
Life of this patent
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Abstract
A method of cutting an electronic component mounted on a circuit board includes: a step of applying adhesive to a predetermined area including at least an outermost peripheral portion of an upper surface of the electronic component and attaching a dustproof sheet to the upper surface of the electronic component; and a step of cutting the electronic component while maintaining a state where the dustproof sheet is attached to the outermost peripheral portion.
Claims22
A method of cutting an electronic component mounted on a circuit board, the method comprising:
- applying adhesive to a predetermined area including at least an outermost peripheral portion of an upper surface of the electronic component, and attaching a dustproof sheet to the upper surface of the electronic component;
- and
- cutting the electronic component while maintaining a state where the dustproof sheet is attached to the outermost peripheral portion, wherein an inner side of a portion coated with the adhesive is cut.
(canceled)
The method according to claim I, wherein
- in the cutting the electronic component, different cutting blades are used depending on a material of the electronic component at a location to be cut.
(canceled)
A method of cutting an electronic component mounted on a circuit board, the method comprising:
- applying adhesive to a predetermined area including at least an outermost peripheral portion of an upper surface of the electronic component, and attaching a dustproof sheet to the upper surface of the electronic component;
- and
- cutting the electronic component while maintaining a state where the dustproof sheet is attached to the outermost peripheral portion,
- wherein
- the electronic component is sealed with a sealing material, and
- in the cutting the electronic component, an outermost peripheral portion of the sealing material is left as a wall.
A method of manufacturing an electronic device that includes a circuit board and an electronic component mounted on the circuit board, the method comprising:
- applying adhesive to a predetermined area including at least an outermost peripheral portion of an upper surface of the electronic component, and attaching a dustproof sheet to the upper surface of the electronic component;
- cutting the electronic component while maintaining a state where the dustproof sheet is attached to the outermost peripheral portion;
- removing the electronic component from the circuit board together with the dustproof sheet in a state where the dustproof sheet is attached to the outermost peripheral portion;
- removing a residue at a mounting position of the removed component;
- and
- arranging and mounting a new component at the mounting position.
Dependencies are inferred from the claim text.