Electrical connection device, method for producing the same, and structure of flexible wiring board

A structure of a flexible wiring board, comprising:

• a first flexible base;
• a first adhesive layer disposed on the first flexible base, the first adhesive layer containing a first pressure sensitive adhesive;
• an elastomer pattern disposed on the first adhesive layer, the elastomer pattern being formed of a first cured ink containing a first elastomer composition, wherein a longitudinal elastic modulus of the elastomer pattern is larger than a longitudinal elastic modulus of the first adhesive layer;
• a conductor pattern disposed on the elastomer pattern, the conductor pattern being formed of a cured ink containing conductive particles;
• a second flexible base;
• a second adhesive layer disposed on the second flexible base, the second adhesive layer containing a second pressure sensitive adhesive;
• and
• an elastomer layer disposed on the second adhesive layer, the elastomer layer being formed of a second cured ink containing a second elastomer composition, wherein a longitudinal elastic modulus of the elastomer layer is larger than a longitudinal elastic modulus of the second adhesive layer;
• wherein the first flexible base, the first adhesive layer, the elastomer pattern, and the conductor pattern forming altogether a first layer structure, while the second flexible base, the second adhesive layer, and the elastomer layer forming altogether a second layer structure, the second layer structure lies over the first layer structure in a way that the conductor pattern faces the elastomer layer,
• wherein a part of a surface of the first adhesive layer on which none of the elastomer pattern and the conductor pattern is disposed and a part of a surface of the elastomer layer are bonded to each other so that the first layer structure and the second layer structure are mechanically coupled with each other.

A structure of a flexible wiring board, comprising:

• a first flexible base;
• a first adhesive layer disposed on the first flexible base, the first adhesive layer containing a first pressure sensitive adhesive;
• a first elastomer pattern disposed on the first adhesive layer, the first elastomer pattern being formed of a first cured ink containing a first elastomer composition, wherein a longitudinal elastic modulus of the first elastomer pattern is larger than a longitudinal elastic modulus of the first adhesive layer;
• a first conductor pattern disposed on the first elastomer pattern, the first conductor pattern being formed of a first cured ink containing first conductive particles;
• a second flexible base;
• a second adhesive layer disposed on the second flexible base, the second adhesive layer containing a second pressure sensitive adhesive;
• a second elastomer pattern disposed on the second adhesive layer, the second elastomer pattern being formed of a second cured ink containing a second elastomer composition, wherein a longitudinal elastic modulus of the second elastomer pattern is larger than a longitudinal elastic modulus of the second adhesive layer;
• and
• a second conductor pattern disposed on the second elastomer pattern, the second conductor pattern being formed of a second cured ink containing second conductive particles;
• wherein the first flexible base, the first adhesive layer, the first elastomer pattern, and the first conductor pattern forming altogether a first layer structure, while the second flexible base, the second adhesive layer, the second elastomer pattern, and the second conductor pattern forming altogether a second layer structure, the first layer structure and the second layer structure are mutually superposed in a way that the first conductive pattern and the second conductive pattern are faced to and come into direct contact with each other, the first conductive pattern and the second conductive pattern having mutually superposable shapes,
• wherein a part of a surface of the first adhesive layer on which none of the first elastomer pattern and the first conductor pattern is disposed and a part of a surface of the second adhesive layer on which none of the second elastomer pattern and the second conductor pattern is disposed are bonded to each other so that the first layer structure and the second layer structure are mechanically coupled with each other.