# US 2021/0280751 A1 · Optoelectronic Lighting Device, Optoelectronic Illumination Device and Method of Manufacturing

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- Number: US 2021/0280751 A1
- Document ID: US20210280751A1
- Status: Published application
- Kind: A1
- Application number: 17/270,761
- Filed: 2019-08-09
- Published: 2021-09-09
- Earliest claimed: 2018-08-31
- Assignees: OSRAM OLED GmbH
- Applicants: OSRAM OLED GmbH
- Inventors: Simon Jerebic; Daniel Leisen; Philipp Pust; Thomas Birke
- Web page: https://patentgrep.com/patent/US20210280751A1

## CPC

- H10H 20/8512: {Wavelength conversion materials}
- H10H 20/8514: {characterised by their shape, e.g. plate or foil}
- H10H 20/821: of the light-emitting regions, e.g. non-planar junctions
- H10H 20/856: Reflecting means
- H10W 90/00: Package configurations
- H10H 20/01: Manufacture or treatment
- H10H 20/0361: {of wavelength conversion means}
- H10H 20/0362: {of encapsulations}
- H10H 20/852: Encapsulations
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

In an embodiment an optoelectronic lighting device includes a carrier, exactly one light-emitting optoelectronic semiconductor component, wherein the semiconductor component has a light emission area on at least one surface side, and wherein the semiconductor component is arranged on an upper side of the carrier, at least one functional layer arranged above the light emission area and/or adjacent to the light emission area and an edging for the functional layer, wherein the edging surrounds the functional layer when viewed in a circumferential direction, the circumferential direction being parallel to the upper side of the carrier around the functional layer, and wherein the edging is formed of a transparent material.

## Claims

### Claim at position 1

-16. (canceled)

### Claim 17

An optoelectronic lighting device comprising:
a carrier;
exactly one light-emitting optoelectronic semiconductor component, wherein the semiconductor component has a light emission area on at least one surface side, and wherein the semiconductor component is arranged on an upper side of the carrier;
at least one functional layer arranged above the light emission area and/or adjacent to the light emission area; and
an edging for the functional layer, wherein the edging surrounds the functional layer when viewed in a circumferential direction, the circumferential direction being parallel to the upper side of the carrier around the functional layer, and
wherein the edging is formed of a transparent material.

### Claim 18 (depends on 17)

The optoelectronic lighting device according to claim 17, wherein the edging surrounds the functional layer such that the functional layer is completely arranged within the edging when viewed in a direction parallel to the upper side of the carrier.

### Claim 19 (depends on 17)

The optoelectronic lighting device according to claim 17,
wherein the edging comprises a surrounding border along the circumferential direction, in the center of which a continuous opening is provided, and
wherein the edging surrounds the functional layer such that the center of the border is arranged above the light emission area of the semiconductor component and/or above the center of the semiconductor component and the functional layer fills the opening at least partially.

### Claim 20 (depends on 17)

The optoelectronic lighting device according to claim 17,
wherein a border of the edging has at least one outer surface arranged on a side surface of the lighting device, and
wherein the side surface and/or the outer surface of the border extend at least substantially perpendicular to the upper side of the carrier.

### Claim 21 (depends on 17)

The optoelectronic lighting device according to claim 17, wherein at least one outer surface of a border of the edging does not lie on a side surface of the lighting device but at least one edge layer is formed between the outer surface and the side surface.

### Claim 22 (depends on 17)

The optoelectronic lighting device according to claim 17, wherein the edging has a refractive index which is between a refractive index of the functional layer and air.

### Claim 23 (depends on 17)

The optoelectronic lighting device according to claim 17, wherein the edging is formed of a material comprising of silicone and/or glass.

### Claim 24 (depends on 17)

The optoelectronic lighting device according to claim 17, wherein the functional layer is formed flat on its top side opposite to the upper side of the carrier or has a recess in the middle of the top side.

### Claim 25 (depends on 17)

The optoelectronic lighting device according to claim 17, wherein at least one cover layer is arranged above the functional layer and the edging, and wherein the cover layer is opaque and/or reflective with respect to the functional layer.

### Claim 26

An optoelectronic illumination device comprising:
a carrier with a plurality of light points arranged in a matrix-like manner on an upper side of the carrier, each light point comprising precisely one light-emitting semiconductor component which has a light emission area on at least one surface side;
a functional layer arranged above and/or adjacent to the light emission area of the plurality of light points;
a plurality of edgings for the functional layer, each edging comprising a surrounding border extending along a circumferential direction and in the center of which a continuous opening is provided; and
optionally at least one cover layer above the functional layer and the edgings,
wherein the edgings are arranged at least in a plane of the functional layer such that the center of a respective edging is located at least approximately above a respective light point,
wherein the border surrounds a region of the functional layer above and/or adjacent to the respective light point, and
wherein the region of the functional layer at least partially fills the opening of the respective edging.

### Claim 27 (depends on 26)

The optoelectronic illumination device according to claim 26, wherein the edgings divide the functional layer into individual regions in a matrix-like manner in accordance with the matrix-like arrangement of the light points, wherein, for each region, the center of a respective edging is located at least approximately above a respective light point, and wherein the border surrounds the region of the functional layer above the respective light point.

### Claim 28

A method for manufacturing at least one optoelectronic lighting device, the method comprising:
proving a carrier with a plurality of light points arranged in a matrix-like manner on an upper side of the carrier, each light point comprising at least one light-emitting semiconductor component;
providing a functional layer and a plurality of edgings in a layer plane above and/or adjacent to light emission areas of the plurality of light points; and
optionally providing at least one cover layer above the functional layer and the edgings,
wherein each edging of the plurality of edgings comprises a surrounding border extending along a circumferential direction, in the center of which a continuous opening is provided,
wherein the edgings are arranged such that the center of the border of a respective edging is located at least approximately above a respective light point, and
wherein the edgings divide the functional layer into individual regions above and/or adjacent to the light points.

### Claim 29 (depends on 28)

The method according to claim 28, wherein first the plurality of edgings is arranged or formed in the layer plane, and only then the functional layer is formed in the openings of the edgings, or wherein first the functional layer is formed and then the plurality of edgings is arranged or formed in the layer plane by pressing the plurality of edgings into the functional layer.

### Claim 30 (depends on 28)

The method according to claim 28, wherein the plurality of edgings is formed in a lattice structure made of a transparent material.

### Claim 31 (depends on 28)

The method according to claim 28, wherein the plurality of edgings is first formed by applying a flowable material via a dispensing process, and the functional layer is then formed.

### Claim 32 (depends on 28)

The method according to claim 28, wherein light points of the plurality of light points are separated by cutting the carrier and the layers arranged thereon at planes lying between the points and extending perpendicularly to the upper side of the carrier, and wherein none of the planes extends through the functional layer but exclusively through the edgings or through an intermediate region between adjacent edgings.
