# US 2021/0280737 A1 · Method of manufacturing light emitting device and method of inspecting light emitting device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2021/0280737 A1 - Document ID: US20210280737A1 - Status: Published application - Kind: A1 - Application number: 17/179,320 - Filed: 2021-02-18 - Published: 2021-09-09 - Earliest claimed: 2020-03-09 - Assignees: Nichia Corporation - Applicants: Nichia Corporation - Inventors: Shogo ABE; Yuki OGURA - Web page: https://patentgrep.com/patent/US20210280737A1 ## CPC - H10H 20/01: Manufacture or treatment - H10H 20/853: characterised by their shape - H10H 20/854: characterised by their material, e.g. epoxy or silicone resins - H10H 20/855: Optical field-shaping means, e.g. lenses - H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls - H10W 90/00: Package configurations - H10H 20/0362: {of encapsulations} - H10H 20/0363: {of optical field-shaping means} - H10H 20/0364: {of interconnections} - H10H 20/8506: {Containers} - H10H 20/8514: {characterised by their shape, e.g. plate or foil} - H10W 72/072: {of bump connectors} - H10W 72/073: {of die-attach connectors} - H10W 72/877: {Bump connectors and die-attach connectors} - H10W 74/00: Encapsulations, e.g. protective coatings - H10W 74/15: on active surfaces of flip-chip devices, e.g. underfills - H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A method of manufacturing a light emitting device includes: providing a first intermediate body including a substrate, first bonding members, a second bonding member, a light emitting element, a protecting element, a light transmissive member bonded to the light emitting element, and a light-shielding frame surrounding the light transmissive member in a top view, a portion of an outer periphery of the light-shielding frame being located above the protecting element such that at least a portion of the protecting element is exposed from the light-shielding frame in the top view; disposing a first resin between the light emitting element and the substrate by applying the first resin on the substrate in a region outside of the portion of the protecting element such that the first resin moves toward the light emitting element along the protecting element; and curing the first resin to obtain a first cover member. ## Claims ### Claim 1 A method of manufacturing a light emitting device, the method comprising: providing a first intermediate body including a substrate, a plurality of first bonding members, a second bonding member, a light emitting element mounted on an upper surface of the substrate via the plurality of first bonding members, a protecting element mounted on the upper surface of the substrate via the second bonding member and spaced apart from the light emitting element, a light transmissive member bonded to an upper surface of the light emitting element, and a light-shielding frame surrounding the light transmissive member in a top view, a portion of an outer periphery of the light-shielding frame being located above the protecting element such that at least a portion of the protecting element is exposed from the light-shielding frame in the top view; disposing a first resin between the light emitting element and the substrate by applying the first resin on the substrate in a region outside of the portion of the protecting element exposed from the light-shielding frame in the top view such that the first resin moves toward the light emitting element along the protecting element; and curing the first resin to obtain a first cover member. ### Claim 2 (depends on 1) The method of manufacturing a light emitting device according to claim 1, wherein the disposing of the first resin includes applying the first resin such that the first resin comes into contact with an upper surface of the protecting element. ### Claim 3 (depends on 1) The method of manufacturing a light emitting device according to claim 1, further comprising after the disposing of the first resin, forming a second cover member on the substrate, the second cover member covering the first cover member and lateral surfaces of the light-shielding frame. ### Claim 4 (depends on 1) The method of manufacturing a light emitting device according to claim 1, wherein the providing of the first intermediate body includes providing a second intermediate body, the second intermediate body including the light transmissive member including a first surface, a second surface opposite to the first surface, and lateral surfaces between the first surface and the second surface, the light-shielding frame having an inner surface defining an opening, and a third cover member bonding the inner surface of the light-shielding frame and the lateral surfaces of the light transmissive member. ### Claim 5 (depends on 4) The method of manufacturing a light emitting device according to claim 4, wherein the providing of the first intermediate body includes bonding the second surface of the light transmissive member in the second intermediate body and the upper surface of the light emitting element. ### Claim 6 (depends on 1) The method of manufacturing a light emitting device according to claim 1, wherein the providing of the first intermediate body includes providing the first intermediate body including an additional light emitting element with the light emitting element and the additional light emitting element being aligned along a first direction, and the disposing of the first resin includes applying the first resin along the first direction. ### Claim 7 (depends on 1) The method of manufacturing a light emitting device according to claim 1, wherein the providing of the first intermediate body includes providing the first intermediate body including the light transmissive member containing a phosphor. ### Claim 8 (depends on 1) The method of manufacturing a light emitting device according to claim 1, wherein the providing of the first intermediate body includes providing the first intermediate body including the light transmissive member including a first surface serving as a light emission surface of the light emitting device, a second surface opposite to the first surface, and lateral surfaces disposed between the first surface and the second surface with the first surface having an area dimension smaller than an area dimension of the second surface. ### Claim 9 (depends on 1) The method of manufacturing a light emitting device according to claim 1, wherein the providing of the first intermediate body includes providing the first intermediate body including the light-shielding frame having a thickness in a range of 20 μm to 200 μm. ### Claim 10 (depends on 1) The method of manufacturing a light emitting device according to claim 1, wherein the disposing of the first resin includes applying the first resin having a viscosity in a range of 0.5 Pa·s to 30 Pa·s. ### Claim 11 A method of inspecting a light emitting device, the method comprising: providing a first intermediate body including a substrate, a plurality of first bonding members, a second bonding member, a light emitting element mounted on an upper surface of the substrate via the plurality of first bonding members, a protecting element mounted on the upper surface of the substrate via the second bonding member and spaced apart from the light emitting element, a light transmissive member bonded to an upper surface of the light emitting element, and a light-shielding frame surrounding the light transmissive member in a top view, a portion of an outer periphery of the light-shielding frame being located above the protecting element such that at least a portion of the protecting element is exposed from the light-shielding frame in the top view; disposing a first resin between the light emitting element and the substrate by applying the first resin on the substrate in a region outside of the portion of the protecting element exposed from the light-shielding frame in the top view such that the first resin moves toward the light emitting element along the protecting element; defining an inspection region on the substrate in the region outside of the portion of the protecting element exposed from the light-shielding frame in the top view; and after the disposing of the first resin, inspecting whether the first resin is disposed between the light emitting device and the substrate by detecting a shape of the first resin covering the inspection region.