# US 2021/0280518 A1 · Emib architecture with dedicated metal layers for improving power delivery

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- Number: US 2021/0280518 A1
- Document ID: US20210280518A1
- Status: Published application
- Kind: A1
- Application number: 16/810,192
- Filed: 2020-03-05
- Published: 2021-09-09
- Earliest claimed: 2020-03-05
- Assignees: Intel Corporation
- Applicants: Intel Corporation
- Inventors: Jianyong XIE; Sujit SHARAN; Huang-Ta CHEN
- Web page: https://patentgrep.com/patent/US20210280518A1

## CPC

- H10W 44/00: Electrical arrangements for controlling or matching impedance
- H10W 70/65: Shapes or dispositions of interconnections
- H10W 44/601: {Capacitive arrangements (H10W44/20 takes precedence)}
- H10W 70/611: {for connecting multiple chips together}
- H10W 70/618: {the bridge chips being embedded in the package substrates, interposers or redistribution layers}
- H10W 70/635: {Through-vias}
- H10W 70/685: comprising multiple insulating layers
- H10W 90/00: Package configurations
- H10W 90/401: {characterised by multiple insulating or insulated package substrates, interposers or RDLs}
- H10W 70/63: Vias, e.g. via plugs
- H10W 72/252: {comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu}
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

Embodiments disclosed herein include electronic packages with a bridge that comprise improved power delivery architectures. In an embodiment, a bridge comprises a substrate and a routing stack over the substrate. In an embodiment, the routing stack comprises first routing layers, where individual ones of the first routing layers have a first thickness, and a second routing layer, where the second routing layer has a second thickness that is greater than the first thickness.

## Claims

### Claim 1

A bridge, comprising:
a substrate;
a routing stack over the substrate, wherein the routing stack comprises:
first routing layers, wherein individual ones of the first routing layers have a first thickness; and
a second routing layer, wherein the second routing layer has a second thickness that is greater than the first thickness.

### Claim 2 (depends on 1)

The bridge of claim 1, wherein the second routing layer comprises a plurality of sub-layers, wherein individual ones of the sub-layers have thicknesses between 1 μm and 4 μm.

### Claim 3 (depends on 1)

The bridge of claim 1, wherein there are at least four first routing layers.

### Claim 4 (depends on 1)

The bridge of claim 1, wherein the second thickness is at least twice the first thickness.

### Claim 5 (depends on 1)

The bridge of claim 1, wherein the second thickness is approximately 4 μm or greater.

### Claim 6 (depends on 1)

The bridge of claim 1, wherein the second routing layer is between the first routing layers and the substrate.

### Claim 7 (depends on 1)

The bridge of claim 1, wherein the first routing layers are between the second routing layer and the substrate.

### Claim 8 (depends on 1)

The bridge of claim 1, wherein the second routing layer is between a pair of first routing layers.

### Claim 9 (depends on 1)

The bridge of claim 1, further comprising:
a plurality of pads over the routing stack.

### Claim 10 (depends on 9)

The bridge of claim 9, wherein a first pad of the plurality of pads is electrically coupled to the second routing layer by a first via, and a second pad of the plurality of pads is electrically coupled to the second routing layer by a second via, and wherein the first pad is electrically coupled to the second pad by a path comprising the first via, the second routing layer, and the second via.

### Claim 11 (depends on 10)

The bridge of claim 10, wherein a third pad of the plurality of pads is positioned between the first pad and the second pad.

### Claim 12 (depends on 1)

The bridge of claim 1, wherein the second routing layer comprises a first segment and a second segment, and wherein the first segment is electrically isolated from the second segment.

### Claim 13 (depends on 1)

The bridge of claim 1, wherein the second routing layer is a mesh.

### Claim 14

An electronic package, comprising:
a package substrate;
a bridge embedded in the package substrate, wherein the bridge comprises:
a substrate;
a routing stack over the substrate, wherein the routing stack comprises a first routing layer with a first thickness and a second routing layer with a second thickness, wherein the second thickness is greater than the first thickness;
a first die electrically coupled to the bridge; and
a second die electrically coupled to the bridge, wherein the first die is electrically coupled to the second die by the first routing layer.

### Claim 15 (depends on 14)

The electronic package of claim 14, further comprising a first power rail for the first die.

### Claim 16 (depends on 15)

The electronic package of claim 15, wherein the second routing layer is part of the first power rail.

### Claim 17 (depends on 16)

The electronic package of claim 16, wherein the first power rail includes a metal layer in the first die.

### Claim 18 (depends on 16)

The electronic package of claim 16, wherein the first power rail feeds power to a plurality of bumps that connect the first die to the bridge.

### Claim 19 (depends on 18)

The electronic package of claim 18, wherein individual ones of the plurality of bumps are electrically coupled to the second routing layer by a via in the routing stack.

### Claim 20 (depends on 14)

The electronic package of claim 14 wherein the second routing layer comprises a first segment for a first power rail and a second segment for a second power rail.

### Claim 21 (depends on 14)

The electronic package of claim 14, wherein the first die is a processor die, and wherein the second die is a memory die.

### Claim 22 (depends on 14)

The electronic package of claim 14, wherein the routing stack comprises at least four first routing layers.

### Claim 23 (depends on 22)

The electronic package of claim 22, further comprising:
a capacitor on the bridge, wherein a first electrode of the capacitor is the second routing layer and a second electrode of the capacitor is one of the reference layers.

### Claim 24

An electronic system, comprising:
a board;
a package substrate attached to the board;
a bridge embedded in the package substrate, wherein the bridge comprises at least five routing layers, and wherein at least one of the routing layers has a first thickness that is greater than a second thickness of other routing layers;
a first die coupled to the bridge; and
a second die coupled to the bridge, wherein the first die is electrically coupled to the second die by one or more of the routing layers.

### Claim 25 (depends on 24)

The electronic system of claim 24, wherein a power rail for the first die comprises at least a portion of the routing layer with the first thickness.